Patents by Inventor Sean Cian O'Mathuna

Sean Cian O'Mathuna has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220406522
    Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 22, 2022
    Inventors: David P. Cappabianca, Joseph T. DiBene, II, Shawn Searles, Le Wang, Yizhang Yang, Sean Cian O'Mathuna, Santosh Kulkarni, Paul McCloskey, Zoran Pavlovic, William Lawton, Graeme Maxwell, Joseph O'Brien, Hugh Charles Smiddy
  • Patent number: 11430606
    Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: August 30, 2022
    Assignee: Apple Inc.
    Inventors: David P. Cappabianca, Joseph T. DiBene, II, Shawn Searles, Le Wang, Yizhang Yang, Sean Cian O'Mathuna, Santosh Kulkarni, Paul McCloskey, Zoran Pavlovic, William Lawton, Graeme Maxwell, Joseph O'Brien, Hugh Charles Smiddy
  • Publication number: 20190221365
    Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.
    Type: Application
    Filed: August 24, 2017
    Publication date: July 18, 2019
    Inventors: David P. Cappabianca, Joseph T. DiBene, II, Shawn Searles, Le Wang, Yizhang Yang, Sean Cian O'Mathuna, Santosh Kulkarni, Paul McCloskey, Zoran Pavlovic, William Lawton, Graeme Maxwell, Joseph O'Brien, Hugh Charles Smiddy
  • Patent number: 7320936
    Abstract: An insulating layer (5) and a conductive seed layer (6) are applied to a substrate (1) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer (7) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.
    Type: Grant
    Filed: June 21, 2005
    Date of Patent: January 22, 2008
    Assignee: University College Cork - National University of Ireland, Cork
    Inventors: Magall Brunet, Andrew Mark Connell, Paul McCloskey, Terence O'Donnell, Stephen O'Reilly, Sean Cian O'Mathuna
  • Patent number: 6150915
    Abstract: A magnetic component (20) has conductor windings (22a, 22b) surrounded by insulation (21). In addition, the component (20) has a magnetic plate (23a, 23b) on each side. This is applied using conventional PCB process techniques. The magnetic plates enhance the inductance of the component in a manner which may be controlled by setting the configuration of the plates. For example a plate may have a number of isolated sections. Also, the plates on each side may be interconnected by plated through holes to provide a closed core.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: November 21, 2000
    Assignee: National University of Ireland, Cork
    Inventors: Stephen O'Reilly, Maeve Duffy, Terence O'Donnell, Sean Cian O'Mathuna