Abstract: A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render the encapsulant debondable. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

Abstract: A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render the encapsulant debondable. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

Abstract: An automatic thermal debonding system removes slider rows from a stainless steel processing fixture. The system uses a bimodal pitch adjustment and a mechanical row detainment mechanism to remove the rows from the fixture. The system allows full control of all critical process parameters such as accurate and repeatable row placement; controlled temperature and heat flow; controlled mechanical removal pressure; temporal control and variability; clean and contaminant-free working area; and full electrostatic discharge grounding and compatible materials. The bimodal pitch adjustment feature allows for continual, high-speed removal of the ceramic rows from the fixture after an automated heating cycle is complete. As the rows are removed, they are accurately placed into the detainment mechanism for the next process step.