Abstract: An inflatable antenna is disclosed herein that is capable of being deployed in space and other suitable environments and configured to improve RF performance and mechanical stability. Related methods for manufacturing and deploying such inflatable antennas are also described. The inflatable antenna can be configured to form a Gregorian dual reflector confocal parabolic antenna system when inflated. Various antenna structures, mechanisms, and manufacturing and deployment techniques are also disclosed herein that improve the precision and accuracy of RF reflective surfaces of the primary and secondary reflectors, confocal alignment of the primary and secondary reflectors, mechanical stability, and/or to improve the range of RF operation. The inflatable antenna can be manufactured and deployed with less complexity and more precision than existing inflatable antennas.

Abstract: An inflatable antenna is disclosed herein that is capable of being deployed in space and other suitable environments and configured to improve RF performance and mechanical stability. Related methods for manufacturing and deploying such inflatable antennas are also described. The inflatable antenna can be configured to form a Gregorian dual reflector confocal parabolic antenna system when inflated. Various antenna structures, mechanisms, and manufacturing and deployment techniques are also disclosed herein that improve the precision and accuracy of RF reflective surfaces of the primary and secondary reflectors, confocal alignment of the primary and secondary reflectors, mechanical stability, and/or to improve the range of RF operation. The inflatable antenna can be manufactured and deployed with less complexity and more precision than existing inflatable antennas.

Abstract: A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

Abstract: A system is disclosed for deploying a network architecture. A first stage and a second stage of the network architecture are deployed. The second stage is deployed from the first stage. A total deployment across the first stage and the second stage of deployment is determined together before the first stage is deployed.

Abstract: A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. The system is particularly adapted for aligning and mating integrated circuits which have high pin counts. A carrier assembly aligns for mating and interconnecting at least two integrated circuit packages having a plurality of leads extending from the packages. A protective shroud covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package is installed on the carrier assembly and coupled with the protective shroud to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package mounted on a printed circuit board.

Abstract: A component carrier and mating system is disclosed for aligning and mating closely spaced leads of integrated circuit (IC) packages, which protects the integrated circuit packages and permits easy installation. The system is particularly adapted for aligning and mating integrated circuits which have high pin counts. A carrier assembly aligns for mating and interconnecting at least two integrated circuit packages having a plurality of leads extending from the packages. A protective shroud covers the stacked packages to maintain the packages in electrical and mechanical engagement and to assure that no damage occurs to the integrated circuit packages. In one embodiment, a first package is installed on the carrier assembly and coupled with the protective shroud to form a pre-engagement assembly, the pre-engagement assembly is then engaged with a second package mounted on a printed circuit board.