Patents by Inventor Sean D. Simondet

Sean D. Simondet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reduced footprint tool for automated processing of microelectronic substrates
    Patent number: 7134827
    Abstract: The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.
    Type: Grant
    Filed: September 28, 2004
    Date of Patent: November 14, 2006
    Assignee: FSI International, Inc.
    Inventors: Robert E. Larson, Sean D. Simondet, David C. Zimmerman, Todd K. Maciej, Quirin W. Matthys
  • Reduced footprint tool for automated processing of microelectronic substrates
    Patent number: 6979165
    Abstract: The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.
    Type: Grant
    Filed: November 12, 2002
    Date of Patent: December 27, 2005
    Assignee: FSI International, Inc.
    Inventors: Robert E. Larson, Sean D. Simondet, David C. Zimmerman, Todd K. Maciej, Quirin W. Matthys
  • Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
    Patent number: 6822413
    Abstract: Robot system incorporates a versatile end effector that can be used to transport wafers, map wafers, and autocalibrate the movements of the robotic system. Typically, the end effector of the invention is rotatably and/or pivotably coupled to a robotic arm and includes an optical sensor system whose light path preferably includes a directional component that extends along a lengthwise axis of the end effector. Preferably the end effector is independently movable about at least two axes. These characteristics, singly or in combination, allow the end effector to carry out transport, mapping, and autocalibration functions within a relatively small volume either horizontally, vertically, or at other desired orientations.
    Type: Grant
    Filed: March 18, 2003
    Date of Patent: November 23, 2004
    Assignee: FSI International, Inc.
    Inventor: Sean D. Simondet
  • Systems and methods incorporating an end effector with a rotatable and/or pivotable body and/or an optical sensor having a light path that extends along a length of the end effector
    Publication number: 20040012363
    Abstract: Robot system incorporates a versatile end effector that can be used to transport wafers, map wafers, and autocalibrate the movements of the robotic system. Typically, the end effector of the invention is rotatably and/or pivotably coupled to a robotic arm and includes an optical sensor system whose light path preferably includes a directional component that extends along a lengthwise axis of the end effector. Preferably the end effector is independently movable about at least two axes. These characteristics, singly or in combination, allow the end effector to carry out transport, mapping, and autocalibration functions within a relatively small volume either horizontally, vertically, or at other desired orientations.
    Type: Application
    Filed: March 18, 2003
    Publication date: January 22, 2004
    Applicant: FSI International, Inc.
    Inventor: Sean D. Simondet
  • Reduced footprint tool for automated processing of microelectronic substrates
    Publication number: 20030091410
    Abstract: The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.
    Type: Application
    Filed: November 12, 2002
    Publication date: May 15, 2003
    Inventors: Robert E. Larson, Sean D. Simondet, David C. Zimmerman, Todd K. Maciej, Quirin W. Matthys