Patents by Inventor Sean DiStefano

Sean DiStefano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure transducer substrate with self alignment feature
    Patent number: 9146164
    Abstract: In an embodiment, an apparatus includes a first substrate. The first substrate may have a first side for accommodating a first diaphragm. The first substrate may also have a second side. The second side may include a polygonal-shaped depression that is sized to accommodate a second diaphragm associated with a second substrate. The first substrate and first diaphragm may be included in a first assembly and the second substrate and second diaphragm may be included in a second assembly. The first assembly and the second assembly may be included in a stack where at least a portion of the second diaphragm is positioned to fit inside the polygonal-shaped depression in the stack.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: September 29, 2015
    Assignee: Sensata Technologies, Inc.
    Inventors: Wico Hopman, George Van Der Donk, Maarten Van Noorden, Sean DiStefano
  • PRESSURE TRANSDUCER SUBSTRATE WITH SELF ALIGNMENT FEATURE
    Publication number: 20140251030
    Abstract: In an embodiment, an apparatus includes a first substrate. The first substrate may have a first side for accommodating a first diaphragm. The first substrate may also have a second side. The second side may include a polygonal-shaped depression that is sized to accommodate a second diaphragm associated with a second substrate. The first substrate and first diaphragm may be included in a first assembly and the second substrate and second diaphragm may be included in a second assembly. The first assembly and the second assembly may be included in a stack where at least a portion of the second diaphragm is positioned to fit inside the polygonal-shaped depression in the stack.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 11, 2014
    Inventors: Wico Hopman, George Van Der Donk, Maarten Van Noorden, Sean DiStefano