Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation b

Abstract: Introduced here is an attachable unit that connects to a base unit through a snap-fitting mechanism. The attachable unit can include a top housing structure and a bottom housing structure that are ultrasonically welded together. The top housing structure can include the toe portion that is integral with remaining portions of the top housing structure, where the toe portion is configured to provide the snap-fit with the base unit.

Abstract: Devices, methods, and systems related to ultrasound imaging or modulating of the nervous system are described. The devices may comprise, for example, one or more ultrasound transducers, wherein an ultrasound transducer from the one or more ultrasound transducers can comprise an implantable ultrasound transducer, wherein the implantable ultrasound transducer can comprise a sonolucent window. The methods and systems may also comprise, for example, a method of imaging and/or modulating the nervous system of a subject using the one or more ultrasound transducers. The method of imaging and/or modulating the nervous system of the subject can be based on a closed-loop operation, wherein an iteration of the imaging and/or the modulating of the nervous system is based on a prior iteration. The closed-loop operation can comprise ultrasound imaging and ultrasound-based modulating or electrophysiological modulating.

Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation b

Abstract: Introduced here is an attachable unit that connects to a base unit through a snap-fitting mechanism. The attachable unit can include a top housing structure and a bottom housing structure that are ultrasonically welded together. The top housing structure can include the toe portion that is integral with remaining portions of the top housing structure, where the toe portion is configured to provide the snap-fit with the base unit.

Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation b

Abstract: A method of monitoring an internal body temperature of a patient includes detecting a skin temperature of the patient using a temperature sensor in a body-mountable temperature monitor attached to the patient; calculating, using the temperature sensor, a heat flux associated with the body-mountable temperature monitor based on selectively activating a heater in the body-mountable temperature monitor; and determining the internal body temperature of the patient using the skin temperature and the heat flux.

Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation b

Abstract: A method of monitoring an internal body temperature of a patient includes detecting a skin temperature of the patient using a temperature sensor in a body-mountable temperature monitor attached to the patient; calculating, using the temperature sensor, a heat flux associated with the body-mountable temperature monitor based on selectively activating a heater in the body-mountable temperature monitor; and determining the internal body temperature of the patient using the skin temperature and the heat flux.

Abstract: An adhesive layer applicator for a body-mountable device is disclosed. The applicator includes a housing defining a first opening through which a chamber is accessible, and a plurality of adhesive layers and a plurality of adhesive liners alternately stacked on a floor that is movable within the chamber. The size and shape of the opening corresponds to the size and shape of the body-mountable device. The housing is configured to receive at least a portion of the body-mountable device through the opening. A second opening is formed in each adhesive layer in the plurality of adhesive layers and a gel is accommodated within the second openings.

Abstract: Various examples are described for needle alignment for wearable biosensors. One example device includes a housing comprising an upper portion and a lower portion, the housing defining a cavity between the upper portion and the lower portion and configured to be worn on a wearer's skin, wherein: the upper portion defines a first opening extending through the upper portion to the cavity, and the lower portion defines a second opening extending through the lower portion to the cavity, the cavity establishing a substantially unobstructed pathway including the first opening and the second opening to enable an insertion needle to be inserted through the housing; and a needle guide extending into and along a portion of the pathway and aligned with a sensor wire to enable alignment between the insertion needle and the sensor wire.

Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation b

Abstract: Various examples are described for needle alignment for wearable biosensors. One example device includes a housing comprising an upper portion and a lower portion, the housing defining a cavity between the upper portion and the lower portion and configured to be worn on a wearer's skin, wherein: the upper portion defines a first opening extending through the upper portion to the cavity, and the lower portion defines a second opening extending through the lower portion to the cavity, the cavity establishing a substantially unobstructed pathway including the first opening and the second opening to enable an insertion needle to be inserted through the housing; and a needle guide extending into and along a portion of the pathway and aligned with a sensor wire to enable alignment between the insertion needle and the sensor wire.

Abstract: A dosage measurement system is adapted to receive a motion from a dosage injection mechanism disposed within a drug injection pen. The dosage measurement system includes a substrate, a sensing capacitor disposed on the substrate, and a lifting tab. The sensing capacitor includes a dielectric layer disposed between a base plate and an adjustable plate. The lifting tab is attached to the adjustable plate and positioned to engage an undulation pattern disposed on a component attached to the dosage injection mechanism. The lifting tab is adapted to physically change a separation distance between the adjustable plate and the base plate in a reciprocal manner in response to the motion of the dosage injection mechanism and engagement with the undulation pattern. A capacitance of the sensing capacitor changes in response to the engagement of the lifting tab with the undulation pattern and the motion of the dosage injection mechanism.

Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation b

Abstract: An adhesive layer applicator for a body-mountable device is disclosed. The applicator includes a housing defining a first opening through which a chamber is accessible, and a plurality of adhesive layers and a plurality of adhesive liners alternately stacked on a floor that is movable within the chamber. The size and shape of the opening corresponds to the size and shape of the body-mountable device. The housing is configured to receive at least a portion of the body-mountable device through the opening. A second opening is formed in each adhesive layer in the plurality of adhesive layers and a gel is accommodated within the second openings.

Abstract: Introduced here is an attachable unit that connects to a base unit through a snap-fitting mechanism. The attachable unit can include a top housing structure and a bottom housing structure that are ultrasonically welded together. The top housing structure can include the toe portion that is integral with remaining portions of the top housing structure, where the toe portion is configured to provide the snap-fit with the base unit.

Abstract: A method is disclosed that includes removing an adhesive layer from a lower housing of a monitoring device; aligning the monitoring device with an opening of an adhesive applicator; coupling an uppermost adhesive layer that is positioned within the adhesive applicator with the lower housing; and removing the monitoring device from the opening of the adhesive applicator. A shape of the lower housing of the monitor corresponds to the shape of the opening of the adhesive applicator; and aligning the monitoring device with the opening of the adhesive applicator comprises matching the orientation of the lower housing to the orientation of the opening in the adhesive applicator. The method also includes the monitoring device selectively entering a battery preservation mode.

Abstract: A wearable device that includes a monitoring device; and an adhesive layer stack for adhering the monitoring device to the skin of a user. The adhesive layer stack includes a first adhesive layer comprising seam(s) forming a first pattern; and a second adhesive layer comprising seam(s) forming a second pattern; wherein the second adhesive layer is configured to be stacked vertically below the monitoring device and above the first adhesive layer; wherein the first adhesive layer is configured to be stacked vertically below the second adhesive layer and the monitoring device; and wherein: the first pattern is different from the second pattern; the first pattern is offset from the second pattern; and/or the first pattern has a first size and the second pattern has a second size that is different from the first size.

Abstract: An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation b