Patents by Inventor Sean Kuplen

Sean Kuplen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7235201
    Abstract: A device to compact parts out of powder material including a top die and a bottom die movable with respect to each other from an open position to a closed position, at least one punch associated with each of said dies for relative movement between the die and associated punch, said bottom die and bottom punch movable to positions defining a cavity substantially within said top die for receiving powder therein, said bottom punch and said top and bottom dies being relatively movable to draw powder down into a portion of said cavity adjacent the bottom die that is formed due to said relative movement, said top and bottom punches being movable toward each other to compact the powder and form the part, said top and bottom dies being separable to eject the part. Relative movement of the top and bottom die and bottom punch may take place during filling of the cavity with powder.
    Type: Grant
    Filed: December 20, 2004
    Date of Patent: June 26, 2007
    Assignee: BorgWarner Inc.
    Inventors: Edwin Scott Hicklen, Sean Kuplen, Kai Xu, Ryan Sun
  • Publication number: 20070048169
    Abstract: A method of producing parts from powdered metal having a first step of providing a powder, which is compressed at a pressure of 25 to 65 tsi to provide a green compact. The compact is then sintered at 2000° F. to 2400° F. for 20 to 60 minutes and cooled. After the compact has been cooled, the density of the compact is increased to greater than 7.4 g/cc. The compact is austenitized in an atmosphere of gas containing propane and a carbon potential of 0.8%. In one embodiment, the gas also contains ammonia. The compact is heated in the atmosphere at a temperature of 1600° F. for 40 minutes. Immediately following the heating, the compact is quenched in oil a temperature between 120° F. and 150° F. for 10 to 15 minutes. Lastly the compact is tempered at a temperature between 300° F. and 1000° F. for 30 to 90 minutes.
    Type: Application
    Filed: August 25, 2005
    Publication date: March 1, 2007
    Applicant: BorgWarner Inc.
    Inventors: Ryan Sun, Kai Xu, Sean Kuplen, Scott Hicklen
  • Publication number: 20060131775
    Abstract: A device to compact parts out of powder material including a top die and a bottom die movable with respect to each other from an open position to a closed position, at least one punch associated with each of said dies for relative movement between the die and associated punch, said bottom die and bottom punch movable to positions defining a cavity substantially within said top die for receiving powder therein, said bottom punch and said top and bottom dies being relatively movable to draw powder down into a portion of said cavity adjacent the bottom die that is formed due to said relative movement, said top and bottom punches being movable toward each other to compact the powder and form the part, said top and bottom dies being separable to eject the part. Relative movement of the top and bottom die and bottom punch may take place during filling of the cavity with powder.
    Type: Application
    Filed: December 20, 2004
    Publication date: June 22, 2006
    Inventors: Edwin Hicklen, Sean Kuplen, Kai Xu, Ryan Sun