Patents by Inventor Sean L. Bell

Sean L. Bell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8811377
    Abstract: Various embodiments provide an apparatus and method for instrumenting devices to measure power usage using a multi-tier wireless network. An example embodiment includes: establishing communication with a plurality of networked power monitors deployed at particular points in a facility, each power monitor of the plurality of networked power monitors being configured to monitor power consumption of a different one of a plurality of electronic devices in the facility; periodically obtaining system data from each of the plurality of networked power monitors using a wireless sensor network, the system data including power consumption data corresponding to associated electronic devices; using a communication hub to aggregate the system data from a plurality of associated power monitors, the communication hub and the plurality of associated power monitors forming a local network within the wireless sensor network; and using the system data to control operation of the plurality of electronic devices in the facility.
    Type: Grant
    Filed: August 30, 2010
    Date of Patent: August 19, 2014
    Assignee: SynapSense Corporation
    Inventors: Patrick E. Weston, Abraham D. Fechter, Yann T. Ramin, Rituparna Ghosh, Sean L. Bell, Seokman Paul Han, Raju Pandey
  • Patent number: 6954987
    Abstract: A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.
    Type: Grant
    Filed: May 19, 2004
    Date of Patent: October 18, 2005
    Assignee: Powerwave Technologies, Inc.
    Inventors: Kenneth Daryl Wong, Sean L. Bell
  • Publication number: 20040231884
    Abstract: A printed circuit board assembly employing a solder vent hole adjacent solder filled interconnect vias connecting to a conductive pallet, is disclosed. The solder vent hole allows gases to escape from an otherwise sealed cavity during solder reflow, relieving positive pressure and thereby allowing solder to flow into it. By providing an escape path for trapped air and gases generated during solder paste reflow, the out-gassing pressure and weight of the molten solder is sufficient to allow the solder paste to flow into the cavity.
    Type: Application
    Filed: May 19, 2004
    Publication date: November 25, 2004
    Inventors: Kenneth Daryl Wong, Sean L. Bell