Patents by Inventor Sean Lin
Sean Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11968790Abstract: Introduced here is an attachable unit that connects to a base unit through a snap-fitting mechanism. The attachable unit can include a top housing structure and a bottom housing structure that are ultrasonically welded together. The top housing structure can include the toe portion that is integral with remaining portions of the top housing structure, where the toe portion is configured to provide the snap-fit with the base unit.Type: GrantFiled: May 10, 2021Date of Patent: April 23, 2024Assignee: Verily Life Sciences LLCInventors: Arthur Lin, Sean Frick
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Publication number: 20240126147Abstract: An apparatus has a lens assembly which has: a front region with an entrance window of the lens assembly; a window structure at the entrance window; a back region; a lens between the window structure and the back region; and a heater coupled to heat the window structure. The lens assembly includes a reflective surface. The front region is on a first side of the reflective surface. The back region is on a second side of the reflective surface. The reflective surface reflects thermal radiation generated by the heater. The reflected radiation is reflected towards the first side. Other features are also provided.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Inventors: Nile E. Fairfield, William J. Hall, Jace Dispenza, Sean Tauber, David Ovrutsky, Stephanie Lin
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Publication number: 20240085005Abstract: Apparatus and methods for deployment of fixtures. The apparatus may include a system for controlling deployed fixtures. The system may receive user commands different devices in different formats. The fixtures may be independently addressable. The fixtures may be magnetically supported by a fixture support. A brace may join two or more fixture supports without reducing space available to support fixtures. The brace may join a fixture support to a fixture support accessory. An accessory may include a variable-angle junction. The fixture may include articulating joints for controlling the direction of a beam. The fixture may include a lens having an electrically controllable beam spread angle. The fixture may be stowable in the fixture support. The fixture may be slidable along a cord to adjust a height of the fixture. The fixture may include an extendable ring. The system may coordinate motions of the fixtures to follow a target. The fixture may include an elongated board.Type: ApplicationFiled: September 14, 2023Publication date: March 14, 2024Inventors: Sean Tham, Peter Vancorenland, Michael Sabolcik, Voravit Puvanakijjakorn, Jonathan Ian Hoffman, Dimauro Andrade Edwards, Dunping Hu, Jianqiu Hu, Lu Zhongliang, Zou Sikang, Li Renyun, Du Lin, Zhou Wenjie, Wu Chong, Wu Limei, Gong Xingping, Li Jinqiang
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Publication number: 20240068648Abstract: Apparatus and methods for deployment of fixtures. The apparatus may include a system for controlling deployed fixtures. The system may receive user commands different devices in different formats. The fixtures may be independently addressable. The fixtures may be magnetically supported by a fixture support. A brace may join two or more fixture supports without reducing space available to support fixtures. The brace may join a fixture support to a fixture support accessory. An accessory may include a variable-angle junction. The fixture may include articulating joints for controlling the direction of a beam. The fixture may include a lens having an electrically controllable beam spread angle. The fixture may be stowable in the fixture support. The fixture may be slidable along a cord to adjust a height of the fixture. The fixture may include an extendable ring. The system may coordinate motions of the fixtures to follow a target. The fixture may include an elongated board.Type: ApplicationFiled: October 30, 2023Publication date: February 29, 2024Inventors: Sean Tham, Peter Vancorenland, Michael Sabolcik, Voravit Puvanakijjakorn, Jonathan Ian Hoffman, Dimauro Andrade Edwards, Dunping Hu, Jianqiu Hu, Lu Zhongliang, Zou Sikang, Li Renyun, Du Lin, Zhou Wenjie, Wu Chong, Wu Limei, Gong Xingping, Li Jinqiang
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Patent number: 11619597Abstract: A system for non-destructive evaluation of an object uses a spherical coordinate system to control two robotic arms. In some examples, the system includes a radiation source coupled to one robotic arm, a radiation detector coupled to the other robotic arm; and a control unit configured to determine, based on input, a first position located on a first surface of a first sphere within the spherical coordinate system; determine, based on the input, a second position located on a second surface of a second sphere within the spherical coordinate system, wherein the second position is located opposite a midpoint of the spherical coordinate system from the first position; and control a motion of the source robotic arm and the detector robotic arm such that the radiation source and the radiation detector move to different ones of the first position and the second position.Type: GrantFiled: May 27, 2020Date of Patent: April 4, 2023Assignee: Illinois Tool Works Inc.Inventors: Joseph Schlecht, Caleb N. Hay, Jackson Turner, Sean Lin, Sean M. Anderson, Kirk Guillaume, Matthew James Johnson
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Publication number: 20220108129Abstract: Described herein are examples of interfaces for designing and/or configuring custom assisted defect recognition (ADR) systems and/or workflows. In some examples, the ADR systems and/or workflows may be designed and/or configured using visual tools, such as, for example, node based processing tools. In some examples, the ADR workflows may be used to analyze two dimensional (2D) and/or three dimensional (3D) image scans, such as might be generated by industrial X-ray scanning systems.Type: ApplicationFiled: September 29, 2021Publication date: April 7, 2022Inventors: Sean Lin, Joseph Schlecht, Caleb Nelson Hay, Eric Ferley
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Publication number: 20210372952Abstract: A system for non-destructive evaluation of an object uses a spherical coordinate system to control two robotic arms. In some examples, the system includes a radiation source coupled to one robotic arm, a radiation detector coupled to the other robotic arm; and a control unit configured to determine, based on input, a first position located on a first surface of a first sphere within the spherical coordinate system; determine, based on the input, a second position located on a second surface of a second sphere within the spherical coordinate system, wherein the second position is located opposite a midpoint of the spherical coordinate system from the first position; and control a motion of the source robotic arm and the detector robotic arm such that the radiation source and the radiation detector move to different ones of the first position and the second position.Type: ApplicationFiled: May 27, 2020Publication date: December 2, 2021Inventors: Joseph Schlecht, Caleb N. Hay, Jackson Turner, Sean Lin, Sean M. Anderson, Kirk Guillaume, Matthew James Johnson
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Patent number: 10879098Abstract: The various embodiments provide a semiconductor chip holder that holds semiconductor chips. The chip holder protects the semiconductor chips from possible damage during transport and/or storage. The chip holder is flexible and may be wound around a reel for convenient transport and storage. In one embodiment, the chip holder includes a support substrate with receptacles that receive semiconductor chips, a cover layer that seals the receptacles and holds the semiconductor chips within the receptacles, and plugs to securely couple the support substrate and the cover layer together.Type: GrantFiled: September 18, 2018Date of Patent: December 29, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Jen Liao, Pei-Haw Tsao, Tsui-Mei Chen, Yu-Jung Lin, Ju-Min Chen, Sean Lin
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Publication number: 20200090970Abstract: The various embodiments provide a semiconductor chip holder that holds semiconductor chips. The chip holder protects the semiconductor chips from possible damage during transport and/or storage. The chip holder is flexible and may be wound around a reel for convenient transport and storage. In one embodiment, the chip holder includes a support substrate with receptacles that receive semiconductor chips, a cover layer that seals the receptacles and holds the semiconductor chips within the receptacles, and plugs to securely couple the support substrate and the cover layer together.Type: ApplicationFiled: September 18, 2018Publication date: March 19, 2020Inventors: Tsung-Jen Liao, Pei-Haw Tsao, Tsui-Mei Chen, Yu-Jung Lin, Ju-Min Chen, Sean Lin
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Patent number: 9831100Abstract: Provided are methods for fabricating transistors using a gate last approach. These methods involve etching of titanium nitride and titanium carbide structures while preserving high k-dielectric structures. The titanium carbide structures may also include aluminum. Etching may be performed in one or more etching solutions, each including hydrogen peroxide. Titanium nitride and titanium carbide structures can be etched simultaneously (non-selectively) in the same etching solution that also includes hydrochloric acid, in addition to hydrogen peroxide, and maintained at about 25° C. and 85° C. In some embodiments, titanium nitride structures and titanium carbide structures may be etched separately (selectively) in different operations and using different etching solutions. The titanium nitride structures may be etched in a diluted hydrogen peroxide solution maintained at about 25° C. and 85° C.Type: GrantFiled: June 24, 2014Date of Patent: November 28, 2017Assignees: Intermolecular, Inc., International Business MachinesInventors: John Foster, Sean Lin, Muthumanickam Sankarapandian, Ruilong Xie
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Patent number: 9439565Abstract: A digital microscope slide image tiling server 16 divides digital microscope slide image 24 into tiles 28. Each tile 28 is labeled with a magnification level and a location relative to the digital microscope slide image 24 that each tile 28 originated. A communications device 20 receives a pathologist selection 40 that designates a portion of a specimen to view at a different magnification. The communications device 20 provides the magnification level and location 44 to the digital microscope slide image tiling server 16. The digital microscope slide image tiling server 16 provides the tiles 38 labeled with the magnification level and location provided by the pathologist selection 40 to the communications device 20. The communications device 20 correlates the coordinate set associated with each tile 38 to the viewer interface of the communications device 20. The communications device 20 displays the tiles 38 via the viewer interface.Type: GrantFiled: July 8, 2013Date of Patent: September 13, 2016Assignee: Dermatopathology Laboratory of Central States, Inc.Inventors: Gary Chai, Ben Chen, Sean Lin
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Publication number: 20160181087Abstract: Particle-clean formulations and methods for semiconductor substrates use aqueous solutions of tetraethylammonium hydroxide (“TEAH,” C8H21NO) with or without hydrogen peroxide (H2O2). The solution pH ranges from 8-12.5. At process temperatures between 20-70 C, the TEAH solutions have been observed to remove particles from silicon-germanium (SiGe) with 20-99% Ge content in 15-300 seconds with very little etching (SiGe etch rates<1 nm/min).Type: ApplicationFiled: December 19, 2014Publication date: June 23, 2016Inventors: John Foster, Steven Bentley, Sean Lin, Dave Rath, Muthumanickam Sankarapandian, Ruilong Xie
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Patent number: 9318436Abstract: One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier layer in the trench/via, forming a copper-based seed layer on the barrier layer, converting at least a portion of the copper-based seed layer into a copper-based nitride layer, depositing a bulk copper-based material on the copper-based nitride layer so as to overfill the trench/via and performing at least one chemical mechanical polishing process to remove excess materials positioned outside of the trench/via to thereby define a copper-based conductive structure. A device disclosed herein includes a layer of insulating material, a copper-based conductive structure positioned in a trench/via within the layer of insulating material and a copper-based silicon or germanium nitride layer positioned between the copper-based conductive structure and the layer of insulating material.Type: GrantFiled: August 27, 2014Date of Patent: April 19, 2016Assignee: GLOBALFOUNDRIES Inc.Inventors: Xunyuan Zhang, Larry Zhao, Ming He, Sean Lin, John Iacoponi, Errol Todd Ryan
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Publication number: 20150371872Abstract: Provided are methods for fabricating transistors using a gate last approach. These methods involve etching of titanium nitride and titanium carbide structures while preserving high k-dielectric structures. The titanium carbide structures may also include aluminum. Etching may be performed in one or more etching solutions, each including hydrogen peroxide. Titanium nitride and titanium carbide structures can be etched simultaneously (non-selectively) in the same etching solution that also includes hydrochloric acid, in addition to hydrogen peroxide, and maintained at about 25° C. and 85° C. In some embodiments, titanium nitride structures and titanium carbide structures may be etched separately (selectively) in different operations and using different etching solutions. The titanium nitride structures may be etched in a diluted hydrogen peroxide solution maintained at about 25° C. and 85° C.Type: ApplicationFiled: June 24, 2014Publication date: December 24, 2015Inventors: John Foster, Sean Lin, Muthumanickam Sankarapandian, Ruilong Xie
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Publication number: 20140361435Abstract: One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier layer in the trench/via, forming a copper-based seed layer on the barrier layer, converting at least a portion of the copper-based seed layer into a copper-based nitride layer, depositing a bulk copper-based material on the copper-based nitride layer so as to overfill the trench/via and performing at least one chemical mechanical polishing process to remove excess materials positioned outside of the trench/via to thereby define a copper-based conductive structure. A device disclosed herein includes a layer of insulating material, a copper-based conductive structure positioned in a trench/via within the layer of insulating material and a copper-based silicon or germanium nitride layer positioned between the copper-based conductive structure and the layer of insulating material.Type: ApplicationFiled: August 27, 2014Publication date: December 11, 2014Inventors: Xunyuan Zhang, Larry Zhao, Ming He, Sean Lin, John Iacoponi, Errol Todd Ryan
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Patent number: 8900400Abstract: A proximity head defined by a body having a length. The body includes a main bore defined therein and extending along the length. A resistor bore is defined in the body and extends along the length. The resistor bore defined below the main bore. A first plurality of bores defined between the main bore and the resistor bore and a second plurality of bores defined between the resistor bore and an exterior surface of the body. The exterior surface of the body defining a proximity surface of the proximity head.Type: GrantFiled: October 26, 2012Date of Patent: December 2, 2014Assignee: Lam Research CorporationInventors: Arnold Kholodenko, Cheng-Yu (Sean) Lin, Russell Martin
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Patent number: 8900374Abstract: A substrate is moved below a substrate cleaning module in a direction extending from a leading edge to a trailing edge of the substrate cleaning module. A cleaning material is dispensed downward toward a top surface of the substrate along the leading edge of the substrate cleaning module. A rinsing material is dispensed downward toward the top surface of the substrate along the trailing edge of the substrate cleaning module to generate a rinsing meniscus. Vacuum suction is applied at a vacuum suction location along a bottom surface of the substrate cleaning module and parallel to the leading and trailing edges of the substrate cleaning module. The vacuum location is positioned between a dispense location of the cleaning material and a dispense location of the rinsing material. A plenum region located between the dispense location of the cleaning material and the vacuum location is vented.Type: GrantFiled: November 9, 2010Date of Patent: December 2, 2014Assignee: Lam Research CorporationInventors: Cheng-Yu (Sean) Lin, Mark Kawaguchi, Mark Wilcoxson, Russell Martin, Leon Ginzburg
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Patent number: 8859419Abstract: One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier layer in the trench/via, forming a copper-based seed layer on the barrier layer, converting at least a portion of the copper-based seed layer into a copper-based nitride layer, depositing a bulk copper-based material on the copper-based nitride layer so as to overfill the trench/via and performing at least one chemical mechanical polishing process to remove excess materials positioned outside of the trench/via to thereby define a copper-based conductive structure. A device disclosed herein includes a layer of insulating material, a copper-based conductive structure positioned in a trench/via within the layer of insulating material and a copper-based silicon or germanium nitride layer positioned between the copper-based conductive structure and the layer of insulating material.Type: GrantFiled: February 1, 2013Date of Patent: October 14, 2014Assignee: GLOBALFOUNDRIES Inc.Inventors: Xunyuan Zhang, Larry Zhao, Ming He, Sean Lin, John Iacoponi, Errol Todd Ryan
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Publication number: 20140217588Abstract: One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier layer in the trench/via, forming a copper-based seed layer on the barrier layer, converting at least a portion of the copper-based seed layer into a copper-based nitride layer, depositing a bulk copper-based material on the copper-based nitride layer so as to overfill the trench/via and performing at least one chemical mechanical polishing process to remove excess materials positioned outside of the trench/via to thereby define a copper-based conductive structure. A device disclosed herein includes a layer of insulating material, a copper-based conductive structure positioned in a trench/via within the layer of insulating material and a copper-based silicon or germanium nitride layer positioned between the copper-based conductive structure and the layer of insulating material.Type: ApplicationFiled: February 1, 2013Publication date: August 7, 2014Applicant: GLOBALFOUNDRIES INC.Inventors: Xunyuan Zhang, Larry Zhao, Ming He, Sean Lin, John Iacoponi, Errol Todd Ryan
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Patent number: 8757177Abstract: A first application of a cleaning material is made to a surface of a substrate. The cleaning material includes one or more viscoelastic materials for entrapping contaminants present on the surface of the substrate. A first application of a rinsing fluid is made to the surface of the substrate so as to rinse the cleaning material from the surface of the substrate. The first application of the rinsing fluid is also performed to leave a residual thin film of the rinsing fluid on the surface of the substrate. A second application of the cleaning material is made to the surface of the substrate having the residual thin film of rinsing fluid present thereon. A second application of the rinsing fluid is then made to the surface of the substrate so as to rinse the cleaning material from the surface of the substrate.Type: GrantFiled: November 6, 2012Date of Patent: June 24, 2014Assignee: Lam Research CorporationInventors: Arnold Kholodenko, Katrina Mikhaylichenko, Cheng-Yu (Sean) Lin, Mark Wilcoxson, Leon Ginzburg, Mark Kawaguchi