Abstract: Disclosed herein is a feeder that includes a receiver configured to receive a reel of carrier tape having media disposed thereon, a presentation location configured to present media from the reel for a subsequent picking process, a media straightener. The media straightener includes an inlet configured to receive the carrier tape and an outlet configured to expel the carrier tape to the presentation location. The media straightener includes a path located between the inlet and the outlet, the path including a first bend configured to permanently deform the media as the carrier tape moves through the first bend. Further disclosed is a media straightener and a method of straightening media.

Abstract: Disclosed herein is a method for transferring die from a wafer that includes picking two or more die from a wafer using a multi-spindle picking head, wherein the multi-spindle picking head is rotatable. The method includes moving the multi-spindle picking head from the wafer feeder to a placement machine, and presenting the two or more picked die to the placement machine for subsequent placement. Further disclosed herein is an apparatus for transferring die from a wafer that includes a picking head with a plurality of spindles. Each spindle is configured to pick a die from a wafer of die. The multi-spindle picking head is rotatable and moveable in at least one direction.

Abstract: A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.

Abstract: Wave soldering method and apparatus for fluxing a substrate in a low oxygen containing atmosphere, preheating the fluxed substrate at least partially in a non-low oxygen containing atmosphere, and soldering the preheated substrate in a low oxygen containing atmosphere.