Patents by Inventor Sean M. Halton

Sean M. Halton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal management for light-emitting diodes
    Patent number: 10495294
    Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: December 3, 2019
    Assignee: Intel Corporation
    Inventors: Ketan R. Shah, Sean M. Halton
  • THERMAL MANAGEMENT FOR LIGHT-EMITTING DIODES
    Publication number: 20170321873
    Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
    Type: Application
    Filed: May 22, 2017
    Publication date: November 9, 2017
    Applicant: INTEL CORPORATION
    Inventors: Ketan R. Shah, Sean M. Halton
  • Thermal management for light-emitting diodes
    Patent number: 9657931
    Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: May 23, 2017
    Assignee: INTEL CORPORATION
    Inventors: Ketan R. Shah, Sean M. Halton
  • THERMAL MANAGEMENT FOR LIGHT-EMITTING DIODES
    Publication number: 20130285545
    Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
    Type: Application
    Filed: December 21, 2011
    Publication date: October 31, 2013
    Inventors: Ketan R. Shah, Sean M. Halton