Abstract: A printed circuit laminate is provided comprising at least one conductor trace for carrying forward electrical signals in a first direction of signal propagation. The printed circuit laminate also comprises a mesh reference plane, spaced from the at least one conductor trace, for carrying return electrical signals in a second direction. The mesh reference plane defines a plurality of cells. Each cell of the plurality of cells includes at least one axis of repetition. The plurality of cells are configured so that all of the axes of repetition of each cell are different from the first direction of signal propagation. Furthermore, the frequency of cell repetition along the first direction of signal propagation is chosen to reduce differences in transmission line impedance between any two conductors on the same laminate or any two conductors on different laminates.

Abstract: Card adapter modules and methods for connecting peripheral cards to computing systems are disclosed. The card adapter modules each include a card connector, a peripheral connector, and a housing that supports the card connector and peripheral connector. A peripheral card is connected to a computing system having a chassis with an input/output slot by inserting the peripheral card along a first insertion axis (y-axis) into a card connector of a card adapter module and inserting the card adapter module along a second insertion axis (x-axis) extending through the input/output slot to a platform connector of a computing platform within the computing system. The card connector is electrically connected to the peripheral connector.

Abstract: A heat sink is configured to support an edge of a circuit card. The heat sink comprises a thermally conductive base, a plurality of thermally conductive heat dissipating fins extending from the base, and one or more recesses at least partially defined by at least one of the fins or by the base. The recesses are configured to support the edge of the circuit card.

Abstract: A computer module for use in a scalable computer system is provided. The computer module includes a chassis at least partially defining an interior and a processor board configured for insertion into a processor region of the interior of the chassis along an insertion axis. The processor board includes at least one connector for communicating signals to and from the processor board. The connector of the processor board is oriented along a connection axis that is substantially perpendicular to the insertion axis. The computer module also includes a memory board configured for insertion into a memory region of the interior of the chassis along the insertion axis. The memory board includes at least one connector for communicating signals to and from the memory board. The connector of the memory board is oriented along the connection axis.

Abstract: A computer system is provided. The computer system includes a computer chassis at least partially defining an interior. The computer system also includes a module configured for movement with respect to the computer chassis along an insertion axis between a retracted position substantially within the interior of the computer chassis and an extended position at least partially withdrawn from the interior of the chassis. The module includes a housing configured to extend within the interior of the chassis. The housing includes a body portion configured to move with respect to the computer chassis along the insertion axis, and a pivoting portion coupled to the body portion to pivot between a retracted position substantially aligned along the insertion axis and an extended position oriented at an angle with respect to the insertion axis.

Abstract: A computer system is provided. The computer system includes a computer chassis at least partially defining an interior. The computer system also includes a module configured for movement with respect to the computer chassis along an insertion axis between a retracted position substantially within the interior of the computer chassis and an extended position at least partially withdrawn from the interior of the chassis. The module includes a housing configured to extend within the interior of the chassis. The housing includes a body portion configured to move with respect to the computer chassis along the insertion axis, and a pivoting portion coupled to the body portion to pivot between a retracted position substantially aligned along the insertion axis and an extended position oriented at an angle with respect to the insertion axis.

Abstract: A computer module for use in a scalable computer system is provided. The computer module includes a chassis at least partially defining an interior and a processor board configured for insertion into a processor region of the interior of the chassis along an insertion axis. The processor board includes at least one connector for communicating signals to and from the processor board. The connector of the processor board is oriented along a connection axis that is substantially perpendicular to the insertion axis. The computer module also includes a memory board configured for insertion into a memory region of the interior of the chassis along the insertion axis. The memory board includes at least one connector for communicating signals to and from the memory board. The connector of the memory board is oriented along the connection axis.

Abstract: A connection assembly for providing interconnection between a computer processor assembly and a module is provided. The connection assembly includes a flex circuit having signal paths for communication between the computer processor assembly and the module. The connection assembly also includes a connector coupled to an end portion of the flex circuit and configured to connect to the computer processor assembly. The connection assembly also includes another connector coupled to an opposite end portion of the flex circuit and is configured to connect to the module. The flex circuit is configured to facilitate movement of the module with respect to the computer processor assembly, the flex circuit having a retracted position with the module proximate to the computer processor assembly and an extended position with the module spaced from the computer processor assembly.

Abstract: A solder head is adapted to direct the flow of solder from a solder fountain. The solder head includes a wall forming a passage through which solder can flow upwardly and having an edge portion over which solder can flow from the passage. The solder head also includes a shield connected to the wall. The shield and the wall at least partially define an overflow passage through which solder can flow downwardly. The shield is configured to prevent contact between solder and an electronic component adjacent the solder head. Corresponding soldering systems and soldering methods are also provided.