Patents by Inventor Sean M. Tsuji

Sean M. Tsuji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature curable epoxy tape and method of making same
    Patent number: 9067395
    Abstract: A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: June 30, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: David J. Plaut, Sean M. Tsuji, Chin Teong Ong, Siang Kwang Lee
  • LOW TEMPERATURE CURABLE EPOXY TAPE AND METHOD OF MAKING SAME
    Publication number: 20130333838
    Abstract: A low temperature curable epoxy tape is provided that can be useful as a semi-structural adhesive tape in the automotive, aerospace, and electronics industries to form metal-to-metal and metal-to-plastic bonds. The provided epoxy tape includes a curative layer. The curative layer includes a scrim, a binder layer at least partially enclosing the scrim, and a latent curative dispersed in the binder layer. The curative layer is coated and then dried of solvent. Then an epoxy layer is laminated to a top and a bottom of the curative layer. The epoxy tape is placed between two parts being bonded together and then heated to temperatures of bottom up to about 110° C. to activate and disperse the active curative. A semi-structural bond is formed. Also, a method of making the epoxy tape is provided.
    Type: Application
    Filed: August 17, 2011
    Publication date: December 19, 2013
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: David J. Plaut, Sean M. Tsuji, Chin Teong Ong, Siang Kwang Lee