Patents by Inventor Sean Mathew Garner

Sean Mathew Garner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Counterbore pocket structure for fluidic assembly
    Patent number: 10644190
    Abstract: A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: May 5, 2020
    Assignee: eLux Inc.
    Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski
  • Diodes offering asymmetric stability during fluidic assembly
    Patent number: 10643870
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 5, 2020
    Assignee: eLux Inc.
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Fluidic assembly top-contact LED disk
    Patent number: 10475958
    Abstract: Embodiments are related to systems and methods for forming and using a top-contact disk.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: November 12, 2019
    Assignee: eLux Inc.
    Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski
  • Diodes Offering Asymmetric Stability During Fluidic Assembly
    Publication number: 20190273006
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: May 22, 2019
    Publication date: September 5, 2019
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Diodes offering asymmetric stability during fluidic assembly
    Patent number: 10347513
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: July 9, 2019
    Assignee: eLux Inc.
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Substrate features for enhanced fluidic assembly of electronic devices
    Patent number: 10243098
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: March 26, 2019
    Assignee: eLux Inc.
    Inventors: David Robert Heine, Sean Mathew Garner, Avinash Tukaram Shinde
  • Fluidic assembly top-contact LED disk
    Patent number: 10115862
    Abstract: A method is provided for forming a direct emission display. The method provides a transparent substrate with an array of wells formed in its top surface. A fluid stream is supplied to the substrate top surface comprising a plurality of top-contact light emitting diode (LED) disks. The wells are filled with the LED disks. A first array of electrically conductive lines is formed over the substrate top surface to connect with a first contact of each LED disk, and a second array of electrically conductive lines is formed over the substrate top surface to connect with a second contact of each LED disk. An insulator over the disk exposes an upper disk (e.g., p-doped) contact region. A via is formed through the disk, exposing a center contact region of a lower (e.g., n-doped) disk contact region. Also provided are a top-contact LED disk and direct emission display.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: October 30, 2018
    Assignee: eLux Inc.
    Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski
  • Substrate Features for Enhanced Fluidic Assembly of Electronic Devices
    Publication number: 20180145207
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: January 1, 2018
    Publication date: May 24, 2018
    Inventors: David Robert Heine, Sean Mathew Garner, Avinash Tukaram Shinde
  • Diodes Offering Asymmetric Stability During Fluidic Assembly
    Publication number: 20180144957
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: January 1, 2018
    Publication date: May 24, 2018
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Counterbore Pocket Structure for Fluidic Assembly
    Publication number: 20180138355
    Abstract: A fluidic assembly method is provided that uses a counterbore pocket structure. The method is based upon the use of a substrate with a plurality of counterbore pocket structures formed in the top surface, with each counterbore pocket structure having a through-hole to the substrate bottom surface. The method flows an ink with a plurality of objects over the substrate top surface. As noted above, the objects may be micro-objects in the shape of a disk. For example, the substrate may be a transparent substrate and the disks may be light emitting diode (LED) disks. Simultaneously, a suction pressure is created at the substrate bottom surface. In response to the suction pressure from the through-holes, the objects are drawn into the counterbore pocket structures. Also provided is a related fluidic substrate assembly.
    Type: Application
    Filed: January 1, 2018
    Publication date: May 17, 2018
    Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski
  • Delayed Via Formation in Electronic Devices
    Publication number: 20180130705
    Abstract: Embodiments are related to systems and methods for forming vias in a substrate, and more particularly to systems and methods for forming vias in a substrate with non-via processing intervening between via processing steps.
    Type: Application
    Filed: November 7, 2016
    Publication date: May 10, 2018
    Inventors: Tian Huang, Sean Mathew Garner
  • Substrate Features for Enhanced Fluidic Assembly of Electronic Devices
    Publication number: 20180076352
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: September 15, 2016
    Publication date: March 15, 2018
    Inventors: David Robert Heine, Sean Mathew Garner, Avinash Tukaram Shinde
  • Substrate features for enhanced fluidic assembly of electronic devices
    Patent number: 9917226
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate. In some cases, embodiments include a substrate including a plurality of wells each having a sidewall where a through hole via extends from a bottom of at least one of the plurality of wells; and a post enhanced diode including a post extending from a top surface of a diode structure.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: March 13, 2018
    Assignee: Sharp Kabushiki Kaisha
    Inventors: David Robert Heine, Sean Mathew Garner, Avinash Tukaram Shinde
  • Diodes offering asymmetric stability during fluidic assembly
    Patent number: 9892944
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: February 13, 2018
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • DIODES OFFERING ASYMMETRIC STABILITY DURING FLUIDIC ASSEMBLY
    Publication number: 20170372927
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: June 23, 2016
    Publication date: December 28, 2017
    Inventors: PAUL JOHN SCHUELE, DAVID ROBERT HEINE, MARK ALBERT CROWDER, SEAN MATHEW GARNER, CHANGQING ZHAN, AVINASH TUKARAM SHINDE, KENJI ALEXANDER SASAKI, KURT MICHAEL ULMER
  • Systems and methods for creating fluidic assembly structures on a substrate
    Patent number: 9837390
    Abstract: Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structures on a substrate.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: December 5, 2017
    Assignee: Corning Incorporated
    Inventors: Michael Lesley Sorensen, Sean Mathew Garner
  • Fluidic Assembly Top-Contact LED Disk
    Publication number: 20170338379
    Abstract: Embodiments are related to systems and methods for forming and using a top-contact disk.
    Type: Application
    Filed: August 10, 2017
    Publication date: November 23, 2017
    Inventors: Changqing Zhan, Paul John Schuele, Mark Albert Crowder, Sean Mathew Garner, Timothy James Kiczenski