Patents by Inventor Sean Michael ARCHER

Sean Michael ARCHER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Liquid submersion cooled electronic systems and devices
    Patent number: 11122704
    Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: September 14, 2021
    Assignee: LiquidCool Solutions, Inc.
    Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
  • LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS AND DEVICES
    Publication number: 20200107470
    Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
    Type: Application
    Filed: November 15, 2019
    Publication date: April 2, 2020
    Inventors: Sean Michael ARCHER, Steve SHAFER, David ROE, Lyle Rick TUFTY
  • LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS AND DEVICES
    Publication number: 20200107468
    Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
  • Liquid submersion cooled electronic systems and devices
    Patent number: 10609839
    Abstract: Liquid submersion cooling devices and systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool individual electronic devices or an array of electronic devices. In one embodiment, the electronic device includes a non-pressurized device housing defining an interior space where pressure in the interior space equals or is only slightly different than pressure outside the non-pressurized device housing.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: March 31, 2020
    Assignee: LIQUIDCOOL SOLUTIONS, INC.
    Inventors: Sean Michael Archer, Steve Shafer, David Roe, Lyle Rick Tufty
  • Liquid submersion cooled electronic systems and devices
    Patent number: 10390458
    Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: August 20, 2019
    Assignee: LIQUIDCOOL SOLUTIONS, INC.
    Inventors: Lyle Rick Tufty, Gary Allan Reed, Sean Michael Archer, Rafael Alba
  • LIQUID SUBMERSION COOLED ELECTRONIC SYSTEMS AND DEVICES
    Publication number: 20190090383
    Abstract: Liquid submersion cooling systems are described that use a cooling liquid, for example a dielectric cooling liquid, to submersion cool an array of electronic devices. In some embodiments described herein, rather than using pump pressure to return the cooling liquid back to a cooling liquid reservoir, gravity can be used to return the cooling liquid to a reservoir via a cooling liquid gravity return manifold, and a pump can only be used on the liquid supply side to deliver the cooling liquid to each electronic device.
    Type: Application
    Filed: September 20, 2018
    Publication date: March 21, 2019
    Inventors: Lyle Rick TUFTY, Gary Allan REED, Sean Michael ARCHER, Rafael ALBA