Abstract: A baseboard includes a first connection configured to electrically interface with a motherboard, a second connection configured to electrically interface with a module, and a switch circuit configured to route data channels and power channels between the motherboard and the module. The first connection is configured to interface with more than one connection protocol or standard. The second connection is configured to interface with the more than one connection protocol or standard. The baseboard allows for cableless connections to allow unobstructed airflow over the components.

Abstract: A system includes a top printed circuit (PCB) including an array of contact pads, a bottom PCB including an array of contact pads, at least one interposer positioned between the top and bottom PCBs, including: an array of top connectors configured to contact the array of contact pads of the top PCB; an array of bottom connectors configured to contact the array of contact pads of the bottom PCB; and interconnections configured to electrically connect the top connectors and the bottom connectors, at least one spacer element positioned between the top PCB and the bottom PCB and configured to contribute to maintaining a specified distance between the top PCB and the bottom PCB; and at least one fastener of the top PCB and the bottom PCB. The system further includes fasteners configured to press the top PCB, the interposer, the bottom PCB, and the spacer layer together.