Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: In a method and system for regulating an output voltage, a linear voltage regulator (LVR) includes an adjustable shunt regulator (ASR) having a limited gain, a feedback circuit (FC), and a compensation resistor (CR). The limited gain causes the output voltage of the ASR to change in response to a change in an input current of the ASR. The FC generates a feedback voltage reference in proportion to the output voltage, the feedback voltage reference being provided to the ASR to control the output voltage. The CR is coupled to the ASR and the FC. The input current flows through the CR to provide a compensating voltage across the CR. The compensating voltage is provided to the feedback circuit to compensate the limited gain, thereby providing the output voltage that is substantially independent of the input current.

Abstract: The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Abstract: In a method and system for regulating an output voltage, a linear voltage regulator (LVR) includes an adjustable shunt regulator (ASR) having a limited gain, a feedback circuit (FC), and a compensation resistor (CR). The limited gain causes the output voltage of the ASR to change in response to a change in an input current of the ASR. The FC generates a feedback voltage reference in proportion to the output voltage, the feedback voltage reference being provided to the ASR to control the output voltage. The CR is coupled to the ASR and the FC. The input current flows through the CR to provide a compensating voltage across the CR. The compensating voltage is provided to the feedback circuit to compensate the limited gain, thereby providing the output voltage that is substantially independent of the input current.

Abstract: Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

Abstract: Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

Abstract: Thick film bond surfaces (8) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16) having raised bosses (24) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16) is fit within a clamp (30) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).

Abstract: Thick film bond surfaces (8 ) on a support structure (10), such as a ceramic substrate or an IC package substrate, tend to deform during processing. A personality kit (16 ) having raised bosses (24 ) engages with and compresses the bond surfaces, resulting in a flatter, wider bond surface having improved reflectivity. The personality kit (16 ) is fit within a clamp (30 ) that can be used as a stand-alone unit or integrated into an existing machine, such as a wire bonder (46).