Patents by Inventor Sean P. McClelland

Sean P. McClelland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140375710
    Abstract: Nozzle layouts for printheads are described. In an example, a printhead includes a first set of drop ejectors having orifices with circular bores, and a second set of drop ejectors having orifices with non-circular bores. A processor receives printing data representing an image to be printed to media, and provides firing data to the printhead for activating the drop ejectors. The firing data selects the drop ejectors with the circular bores to print graphic elements of the image and selecting the drop ejectors with the non-circular bores to print textual elements or line elements of the image.
    Type: Application
    Filed: June 24, 2013
    Publication date: December 25, 2014
    Inventors: Dustin W. Blair, Lawrence H. White, Sean P. McClelland
  • Patent number: 8733902
    Abstract: A print head (24, 224, 424, 624) includes a layer (36, 236) which at least partially forms firing chambers (42, 242) and ribs (46, 246, 646) in contact with opposing side walls of a fluid feed slot (40, 240) while extending from a first side wall to a second opposite side wall within the fluid feed slot (40, 240).
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: May 27, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Bradley D. Chung, Manish Giri, Emmet Whittaker, Sean P McClelland, Andrew Phillips, Benjamin Clark
  • Publication number: 20130328970
    Abstract: A printhead assembly is provided, the printhead assembly including a printhead die, a black fluid slot formed in the printhead die to deliver black printing fluid, and a color fluid slot formed in the printhead die to deliver color printing fluid.
    Type: Application
    Filed: March 31, 2011
    Publication date: December 12, 2013
    Inventors: David Maxfield, Sean P. McClelland
  • Patent number: 7938512
    Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.
    Type: Grant
    Filed: December 4, 2006
    Date of Patent: May 10, 2011
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jong-Souk Yeo, Mark Huth, Mehrgan Khavari, Alexey S Kabalnov, Craig M. Gates, Sean P Mcclelland
  • Publication number: 20110019210
    Abstract: A print head (24, 224, 424, 624) includes a layer (36, 236) which at least partially forms firing chambers (42, 242) and ribs (46, 246, 646) in contact with opposing side walls of a fluid feed slot (40, 240) while extending from a first side wall to a second opposite side wall within the fluid feed slot (40, 240).
    Type: Application
    Filed: May 6, 2008
    Publication date: January 27, 2011
    Inventors: Bradley D. Chung, Manish Giri, Emmet Whittaker, Sean P. Mcclelland, Andrew Phillips, Benjamin Clark
  • Patent number: 7784914
    Abstract: A method of manufacturing a fluid ejection device. A plurality of drive transistors is disposed on a substrate, the drive transistors each comprising contacts. A metal layer is disposed over the contacts. The plurality of drive transistors includes a primitive group of drive transistors, and the metal layer includes a power buss covering each of the contacts of the primitive group of drive transistors.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: August 31, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Simon Dodd, Sean P. McClelland, Lonnie D. Byers
  • Patent number: 7713456
    Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: May 11, 2010
    Assignee: Hewlett-Packard Development Compnay, L.P.
    Inventors: Simon Dodd, Sean P. McClelland, Colby Van Vooren, Terry E. McMahon, Antonio Cruz-Uribe
  • Patent number: 7278706
    Abstract: A fluid ejection device includes a first heater element and a second heater element spaced a first distance from the first heater element. A first drive transistor is associated with the first heater element and a second drive transistor is associated with the second firing heater element. The second drive transistor is spaced a second distance from the first drive transistor. The second distance is different from the first distance.
    Type: Grant
    Filed: October 30, 2003
    Date of Patent: October 9, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Simon Dodd, Sean P. McClelland, Lonnie D. Byers
  • Patent number: 7163640
    Abstract: The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: January 16, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jong-Souk Yeo, Mark Huth, Mehrgan Khavari, Alexey S Kabalnov, Craig M. Gates, Sean P Mcclelland
  • Patent number: 6885083
    Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: April 26, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Simon Dodd, Sean P. McClelland, Colby Van Vooren, Terry E. McMahon, Antonio Cruz-Uribe
  • Publication number: 20040087151
    Abstract: Processing a die that has an edge and a substrate upon which a layer of moisture permeable material is disposed. The moisture permeable material extends to the edge of the die. One embodiment comprises interrupting the layer of moisture permeable material to form a gap at a boundary near the edge, thereby to substantially block movement of moisture through the gap of the moisture permeable material.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Inventors: Simon Dodd, Sean P. McClelland, Colby Van Vooren, Terry E. McMahon, Antonio Cruz-Uribe