Patents by Inventor Sean P. McDevitt

Sean P. McDevitt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10714837
    Abstract: An array antenna with dual polarization elements is provided. Each dual polarization element comprises a first sub-element and a second sub-element, each of which comprises a radiator that is embodied in and/or on a planar member and a balanced feed for the radiator that divides the radiator into two sections that that are mirror images of one another relative to a plane that passes through the balanced feed structure and is perpendicular to the planar member. Further, the radiator of the first sub-element is positioned to lie in an isolation plane associated with the second sub-element. Two such elements are positioned with respect to one another so that the planar members associated with the first elements are coplanar.
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: July 14, 2020
    Assignee: FIRST RF Corporation
    Inventors: Ian S. Rumsey, Sean P. McDevitt, Robert T. Rebich, Dean A. Paschen, Luke S. Sankey
  • Patent number: 9397404
    Abstract: The invention is directed to a crossed-dipole antenna structure that, in one embodiment, is comprised of: (a) a first planar dielectric substrate with a feed portion and an antenna portion that supports a first dipole antenna and (b) a second planar dielectric substrate that supports a second dipole antenna or substantial portion of such an antenna. The first and second planar dielectric substrates are positioned substantially perpendicular to one another and so as to form a crossed-dipole antenna from the first and second dipole antennas. The feed portion of the first planar dielectric substrate is electrically and mechanically connected to the second planar substrate by a plurality of solder joints established in the corners defined by the intersections of the first and second planar dielectric substrates.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: July 19, 2016
    Assignee: FIRST RF Corporation
    Inventors: Sean P. McDevitt, Ian S. Rumsey, Joseph Mruk, P. Keith Kelly