Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.

Abstract: A radio frequency (RF) module comprises a conductive top layer configured to improve RF interference-shielding functionality with respect to one or more RF devices disposed on the module. The conductive top layer may be segmented as to form one or more segments of the top layer that are at least partially electrically isolated from surrounding segments or devices. A module may have a plurality of devices disposed thereon, wherein separate, at least partially isolated, top conductive layers correspond to different devices of the module. The top layer may be etched or cut to achieve such segmentation.

Abstract: A radio frequency (RF) module comprises RF-shielding structure for providing three-dimensional electromagnetic interference shielding with respect to one or more RF devices disposed on the module. The RF-shielding may comprise wirebond structures disposed adjacent to or surrounding an RF device. Two or more intramodule devices may have wirebond structures configured to at least partially block certain types of RF signals disposed between the devices, thereby reducing effects of cross-talk between the devices.

Abstract: Disclosed are systems, devices and methods related to paint mist collection during manufacture of packaged radio-frequency (RF) modules. In some embodiments, a mist-collection system can be implemented, where the system includes a platform configured to support a panel having an array of RF modules formed thereon. The system can further include a mist-collector positioned relative to the platform, with the mist-collector having an input in communication with an output. The mist-collector can be configured to provide suction at a region along one or more sides of the platform to thereby capture at least some of a paint mist generated during the paint-spraying process through the input. The system can further include a pump in communication with the mist-collector to provide the suction.

Abstract: Disclosed are systems and methods related to cleaning during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel. At one or more stages, it can be desirable to perform cleaning operations for such panels. In some embodiments, a cleaning system can include a first belt transport apparatus configured to support a first surface of the panel and move the panel during a cleaning process. The cleaning system can further include a second belt transport apparatus configured to engage a second surface of the panel to keep the panel on the first belt transport apparatus during the cleaning process. At least the second belt transport apparatus can include a mesh, with the mesh having a coating configured to reduce the likelihood of damage to the second surface of the panel and to provide desired electrostatic discharge protection for the panel.

Abstract: Disclosed are systems and methods related to removal of materials by techniques such as ablation during manufacture of radio-frequency (RF) modules. Such modules can be manufactured in an array on a panel, and an overmold structure can be formed on the panel. In some situations, it can be desirable to remove a portion of an upper surface of the overmold to, for example, better expose upper portions of shielding wirebonds. In some embodiments, an ablation system can include a blasting apparatus configured to provide a stream of ablating particles to a blasting region. A first transport section that moves a panel through the blasting region can be separate from a second transport section that feeds or removes the panel to or from the first transport section. Such a configuration can substantially isolate the second transport section from the stream of ablating particles.

Abstract: In applications such as manufacture of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to maintain an acceptable level of suspension of paint particles in solution. A closed recirculation system can be configured to provide such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the recirculator can include a compact peristaltic pump that allows use of shorter fluid paths in the closed recirculation system, as well as a desired level of agitation to quickly achieve the acceptable level of suspension and maintain the suspension for an extended period of time.

Abstract: During fabrication of shielded radio-frequency modules where costly metallic paint is sprayed to form a conductive layer, it is desirable to reduce the amount of paint being utilized, and to reduce the likelihood of accumulation of metal particles along various paths. A closed recirculation system can be provided to yield such desirable features, and can include a reservoir for holding a volume of metallic paint, a spray apparatus for spraying metallic paint received from the reservoir, and a recirculator for recirculating the metallic paint that is not sprayed back to the reservoir. In some embodiments, the spray apparatus can be implemented so as to have reduced dimensions, and include a mechanism for switching between a spray mode and a recirculate mode. Such a spray apparatus can reduce the amount of paint being utilized, and also reduce accumulation of metal particles in the spray apparatus.

Abstract: Aspects of the present disclosure relate to determining a layout of a racetrack that forms part of an RF isolation structure of a packaged module and the resulting RF isolation structures. Locations of where the racetrack can be adjusted (for example, narrowed) and/or removed without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, a portion of the racetrack can be removed to create a break and/or a portion of the racetrack can be narrowed in a selected area.

Abstract: A power amplifier module includes a power amplifier including a GaAs bipolar transistor having a collector, a base abutting the collector, and an emitter, the collector having a doping concentration of at least about 3×1016 cm?3 at a junction with the base, the collector also having at least a first grading in which doping concentration increases away from the base; and an RF transmission line driven by the power amplifier, the RF transmission line including a conductive layer and finish plating on the conductive layer, the finish plating including a gold layer, a palladium layer proximate the gold layer, and a diffusion barrier layer proximate the palladium layer, the diffusion barrier layer including nickel and having a thickness that is less than about the skin depth of nickel at 0.9 GHz. Other embodiments of the module are provided along with related methods and components thereof.

Abstract: Disclosed are devices and methods related to a conductive paint layer configured to provide radio-frequency (RF) shielding for a packaged semiconductor module. Such a module can include a packaging substrate, one or more RF components mounted on the packaging substrate, a ground plane disposed within the packaging substrate, and a plurality of RF-shielding wirebonds disposed on the packaging substrate and electrically connected to the ground plane. The module can further include an overmold structure formed over the packaging substrate and dimensioned to substantially encapsulate the RF component(s) and the RF-shielding wirebonds. The overmold structure can define an upper surface that exposes upper portions of the RF-shielding wirebonds. The module can further include a conductive paint layer having silver flakes disposed on the upper surface of the overmold structure so that the conductive paint layer, the RF-shielding wirebonds, and the ground plane form an RF-shield for the RF component(s).

Abstract: Systems and methods disclose maintaining paint thickness uniformity over the surface of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern achieves paint thickness control. A uniform coating of conductive paint provides a more effective EMI or RFI shield during the operation of the IC modules.

Abstract: Aspects of the present disclosure relate to determining the location and/or density of vias that form part of an RF isolation structure of a packaged module and the resulting RF isolation structures. From electromagnetic interference (EMI) data, locations of where via density can be increased and/or decreased without significantly degrading the EMI performance of the RF isolation structure can be identified. In certain embodiments, one or more vias can be added and/or removed from a selected area of the packaged module based on the EMI data.

Abstract: Systems and methods disclose reduction of conductive paint overspray while maintaining paint thickness uniformity over the perimeter of a cap encapsulating at least one integrated circuit (IC) module on a panel of IC modules. The layer of conductive paint electrically couples with wirebonds on the panel to form at least part of an electromagnetic interference (EMI) or radio frequency interference (RFI) shield that attenuates EMI or RFI during operation of the IC module. Optimizing the spray nozzle diameter, fluid pressure, coaxial air pressure, spray heights, speeds, and spray pattern reduces paint waste and achieves edge uniformity. The reduction in paint overspray reduces paint waste, which in turn, reduces production costs. With the reduced amount of paint needed for coating a panel, the cost per unit can be significantly reduced.

Abstract: Systems, methods and computer program products include job bots that are configured to periodically visit network sites that have stored therein one or more job postings. During each visit, the one or more job postings are analyzed and a searchable job post database is updated to add new job postings, modify changed job postings and delete any removed job postings. A search engine is provided for job seekers to search the searchable job post database where a consolidate list of job postings from the network sites is stored.

Abstract: Disclosed are devices and methods related to radio-frequency (RF) shielding of RF modules. In some embodiments, tuned shielding can be achieved by utilizing different structures and/or arrangements of shielding-wirebonds to increase shielding in areas where needed, and to decrease shielding where not needed. Such tuning of shielding requirements can be obtained by measuring RF power levels at different locations of a module having a given design. Such tuned RF shielding configurations can improve the overall effectiveness of shielding, and can also be more cost effective to implement.

Abstract: Systems, methods and computer program products include job bots that are configured to periodically visit network sites that have stored therein one or more job postings. During each visit, the one or more job postings are analyzed and a searchable job post database is updated to add new job postings, modify changed job postings and delete any removed job postings. A search engine is provided for job seekers to search the searchable job post database where a consolidate list of job postings from the network sites is stored.