Patents by Inventor Sean REIDY

Sean REIDY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11417525
    Abstract: Methods of self-aligned multiple patterning. A hardmask is deposited over an interlayer dielectric layer. A mandrel is formed over the hardmask. A block mask is formed that covers a first lengthwise section of the mandrel and that exposes second and third lengthwise sections of the mandrel. After forming the block mask, the second and third lengthwise sections of the mandrel are removed to define a pattern including respective first and second mandrel lines that are separated from each other by the first lengthwise section of the mandrel. The first mandrel line and the second mandrel line expose respective portions of the hardmask, and the first lengthwise section of the mandrel line covers another portion of the hardmask. The pattern is transferred to the hardmask with an etching process, and subsequently transferred to the interlayer dielectric layer with another etching process.
    Type: Grant
    Filed: October 8, 2018
    Date of Patent: August 16, 2022
    Assignee: GlobalFoundries U.S. Inc.
    Inventors: Martin O'Toole, Keith Donegan, Brendan O'Brien, Hsueh-Chung Chen, Terry A. Spooner, Craig Child, Sean Reidy, Ravi Prakash Srivastava, Louis Lanzerotti, Atsushi Ogino
  • Patent number: 11398378
    Abstract: The present disclosure relates to a structure which includes a first metal layer patterned as a mandrel, a dielectric spacer on the first metal layer, and a second metal layer on the dielectric spacer.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: July 26, 2022
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hsueh-Chung Chen, Ravi P. Srivastava, Somnath Ghosh, Nicholas V. Licausi, Terry A. Spooner, Sean Reidy
  • Publication number: 20210005454
    Abstract: The present disclosure relates to a structure which includes a first metal layer patterned as a mandrel, a dielectric spacer on the first metal layer, and a second metal layer on the dielectric spacer.
    Type: Application
    Filed: September 17, 2020
    Publication date: January 7, 2021
    Inventors: Hsueh-Chung CHEN, Ravi P. SRIVASTAVA, Somnath GHOSH, Nicholas V. LICAUSI, Terry A. SPOONER, Sean REIDY
  • Patent number: 10818494
    Abstract: The present disclosure relates to a structure which includes a first metal layer patterned as a mandrel, a dielectric spacer on the first metal layer, and a second metal layer on the dielectric spacer.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: October 27, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hsueh-Chung Chen, Ravi P. Srivastava, Somnath Ghosh, Nicholas V. Licausi, Terry A. Spooner, Sean Reidy
  • Publication number: 20200111668
    Abstract: Methods of self-aligned multiple patterning. A hardmask is deposited over an interlayer dielectric layer. A mandrel is formed over the hardmask. A block mask is formed that covers a first lengthwise section of the mandrel and that exposes second and third lengthwise sections of the mandrel. After forming the block mask, the second and third lengthwise sections of the mandrel are removed to define a pattern including respective first and second mandrel lines that are separated from each other by the first lengthwise section of the mandrel. The first mandrel line and the second mandrel line expose respective portions of the hardmask, and the first lengthwise section of the mandrel line covers another portion of the hardmask. The pattern is transferred to the hardmask with an etching process, and subsequently transferred to the interlayer dielectric layer with another etching process.
    Type: Application
    Filed: October 8, 2018
    Publication date: April 9, 2020
    Inventors: Martin O'Toole, Keith Donegan, Brendan O'Brien, Hsueh-Chung Chen, Terry A. Spooner, Craig Child, Sean Reidy, Ravi Prakash Srivastava, Louis Lanzerotti, Atsushi Ogino
  • Publication number: 20200083043
    Abstract: The present disclosure relates to a structure which includes a first metal layer patterned as a mandrel, a dielectric spacer on the first metal layer, and a second metal layer on the dielectric spacer.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 12, 2020
    Inventors: Hsueh-Chung CHEN, Ravi P. SRIVASTAVA, Somnath GHOSH, Nicholas V. LICAUSI, Terry A. SPOONER, Sean REIDY