Patents by Inventor Sean SCREWS

Sean SCREWS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210149308
    Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 20, 2021
    Inventors: Benjamin M. JOHNSTON, Preston FUNG, Sean SCREWS, Cheuk Ming LEE, Jae Myung YOO
  • Patent number: 10901328
    Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: January 26, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Benjamin M. Johnston, Preston Fung, Sean Screws, Cheuk Ming Lee, Jae Myung Yoo
  • Publication number: 20200103760
    Abstract: The present disclosure generally relates to a method and apparatus for loading, processing, and unloading substrates. A processing system comprises a load/unload system coupled to a photolithography system. The load/unload system comprises a first set of tracks having a first height and a first width, and a second set of tracks having a second height and a second width different than the first height and first width. An unprocessed substrate is transferred from a lift pin loader to a chuck along the first set of tracks on a first tray while a processed substrate is transferred from the chuck to the lift pin loader along the second set of tracks on a second tray. While a first tray remains with a substrate on the chuck during processing, the load/unload system is configured to unload a processed substrate and load an unprocessed substrate on a second tray.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 2, 2020
    Inventors: Benjamin M. JOHNSTON, Preston FUNG, Sean SCREWS, Cheuk Ming LEE, Jae Myung YOO