Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

Abstract: An apparatus is described. The apparatus includes a cold plate. The ruler factor cold plate is to receive heat from semiconductor chips of a electronic component that is to be plugged into an electronic system. The cold plate has at least one of: a) a linearly advancing physical interface, the linearly advancing physical interface to make physical contact with a corresponding linearly advancing physical interface of a cooling component of the electronic system, the physical contact to create a thermal path from the cold plate to the cooling component; b) first fingers on a first face of the cold plate to make spring-force thermal contact with the semiconductor chips of the electronic component and second fingers on an opposite second face of the cold plate to make spring-force thermal contact with the respective semiconductor chips of another, neighboring electronic component.