Abstract: A fluid ejection cartridge having a cartridge body with a cavity therein and an ejection head attached to an external surface of the cartridge body opposite the cavity. A cylindrical or a rectangular-prism shaped body made of a hydrophilic open-cell foam material is disposed in the cavity of the cartridge body. The cylindrical or rectangular-prism shaped body has at least one uncoated hydrophilic surface and two or more surfaces coated with a hydrophobic material.

Abstract: A small form factor printhead and a thermal ink jet printer containing the reduce form factor printhead. The printhead includes an ink reservoir body having four side walls connected to a bottom wall. An ink supply port is disposed in the bottom wall. An ejection head is attached to an exterior surface of the bottom wall, wherein the ejection head is in ink flow communication with the ink supply port. A flexible circuit is electrically connected to the ejection head and is attached to the exterior surface of the bottom wall and an exterior surface of one of the four side walls. A cover is attached to a distal end of the four side walls opposite the bottom wall. A filter is attached adjacent to an underside of the cover.

Abstract: A composite photoresist material and method of making the composite photoresist material. The composite photoresist material includes: a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin.

Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes an array of nozzle holes and a fluid channel layer attached to an exposed surface of the nozzle plate, wherein the fluid channel layer comprises a fluid channel formed in the fluid channel layer adjacent to each nozzle hole for urging fluid from each nozzle hole.

Abstract: A method for improving adhesion of a nozzle plate to a flow feature layer of an ejection head. The method includes providing a silicon substrate having a device surface containing at least one array of fluid ejectors thereon. A photoresist material is spin-coated onto the device surface. The photoresist material is exposed to actinic radiation through a mask to provide the flow feature layer. The mask contains opaque areas defining fluid flow channels and fluid chambers in the photoresist material and masked areas adjacent to the plurality of fluid flow channels and fluid chambers. The masked areas contain a plurality of opaque geometric particles having a size ranging from about 1 to about 5 microns. The particles are effective to provide a roughened surface area for increased adhesion between the roughened surface area and a nozzle plate attached to the flow feature layer.

Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes at least two arrays of nozzle holes on opposing sides of a fluid supply via etched in an ejection head substrate and a photoresist layer attached to an exposed surface of the nozzle plate spanning a section of the nozzle plate between the at least two arrays of nozzle holes. The photoresist layer increases a thickness of the nozzle plate between the at least two arrays of nozzle holes to greater than 25 microns up to about 100 microns.

Abstract: A method of generating a microfluidic ejection chip is provided. The method includes creating an opening in a silicon substrate through multiple iterations of a deep reactive ion etching process, forming a passivation layer over any exposed portion of silicon at the opening following each iteration of the deep reactive ion etching of the silicon substrate, and not removing the passivation layer at a conclusion of the etching of the silicon substrate to define a fluid passageway at the opening in the silicon substrate, such that the passivation layer is permanent on the silicon substrate at the opening.

Abstract: A composite photoresist material and method of making the composite photoresist material. The composite photoresist material includes: a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin.

Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. An insert is adhesively fastened to the bottom wall. The insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively fastening an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. The insert is a material selected from an epoxy molding compound and a ceramic material. An ejection head chip is adhesively fastened to the die bond surface of the insert.

Abstract: A fluid ejection head for a fluid jet ejection device and a method for improving adhesion between a nozzle plate and a flow feature layer of the ejection head. The fluid ejection head includes a silicon substrate containing at least one array of fluid ejectors deposited thereon. At least one fluid supply via is etched through the silicon substrate adjacent to the at array of fluid ejectors. A flow feature layer is attached to the silicon substrate. The flow feature layer contains at fluid chambers and fluid flow channels corresponding the array of fluid ejectors for ejecting fluid provide fluid from the at least one fluid supply via to fluid chambers. At least a portion of the flow feature layer comprises an attachment surface having improved surface adhesion characteristics, and a nozzle plate containing nozzle holes is laminated to the flow feature layer to provide the fluid ejection head.

Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.

Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes an array of nozzle holes and a fluid channel layer attached to an exposed surface of the nozzle plate, wherein the fluid channel layer comprises a fluid channel formed in the fluid channel layer adjacent to each nozzle hole for urging fluid from each nozzle hole.

Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes at least two arrays of nozzle holes on opposing sides of a fluid supply via etched in an ejection head substrate and a photoresist layer attached to an exposed surface of the nozzle plate spanning a section of the nozzle plate between the at least two arrays of nozzle holes. The photoresist layer increases a thickness of the nozzle plate between the at least two arrays of nozzle holes to greater than 25 microns up to about 100 microns.

Abstract: A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

Abstract: A method of generating a microfluidic ejection chip is provided. The method includes creating an opening in a silicon substrate through multiple iterations of a deep reactive ion etching process, forming a passivation layer over any exposed portion of silicon at the opening following each iteration of the deep reactive ion etching of the silicon substrate, and not removing the passivation layer at a conclusion of the etching of the silicon substrate to define a fluid passageway at the opening in the silicon substrate, such that the passivation layer is permanent on the silicon substrate at the opening.

Abstract: A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.

Abstract: A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.

Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.

Abstract: A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones.