Patents by Inventor Sean T. Weaver

Sean T. Weaver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220242124
    Abstract: A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 4, 2022
    Applicant: Funai Electric Co., Ltd.
    Inventors: Michael A. Marra, III, Sean T. WEAVER
  • Patent number: 11340529
    Abstract: An improved photoimageable dry film formulation, a fluidic ejection head containing a thick film layer derived from the improved photoimageable dry film formulation, and a method for making a fluidic ejection head. The improved photoimageable dry film formulation includes a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: May 24, 2022
    Inventor: Sean T. Weaver
  • Publication number: 20220105724
    Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.
    Type: Application
    Filed: October 6, 2020
    Publication date: April 7, 2022
    Applicant: Funai Electric Co., Ltd.
    Inventor: Sean T. WEAVER
  • Publication number: 20210276015
    Abstract: A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.
    Type: Application
    Filed: March 6, 2020
    Publication date: September 9, 2021
    Inventors: David L. Bernard, Sean T. Weaver
  • Publication number: 20210213745
    Abstract: A fluidic ejection cartridge and protective tape therefor. The cartridge includes a cartridge body for an organic solvent-based fluid having a cover closing a first end thereof, an ejection head on a second end thereof and side walls attached to the first and second ends between the first and second ends. The side walls include a first side wall, a second side wall opposite the first side wall, a first end wall attached to the first and second side walls, and a second end wall opposite the first end wall attached to the first and second side walls. A removable tape is attached to a nozzle plate of the ejection head and to a portion of the first side wall. The removable tape contains a polymeric backing film and a glass-filled, platinum-cured silicone adhesive. The glass-filled, platinum-cured silicone adhesive is cross-linked with silane and a second cross-linking agent.
    Type: Application
    Filed: March 9, 2021
    Publication date: July 15, 2021
    Applicant: Funai Electric Co., Ltd.
    Inventors: Jacob BOYLE, Paul W. DRYER, David C. GRAHAM, Sean T. WEAVER
  • Patent number: 10987935
    Abstract: A fluidic ejection cartridge and protective tape therefor. The fluidic ejection cartridge has a cartridge body for an organic solvent-based fluid having a cover closing a first end thereof, an ejection head on a second end thereof opposite the first end, and side walls attached to the first and second ends between the first and second ends, wherein the side walls comprise a first side wall, a second side wall opposite the first side wall, a first end wall attached to the first and second side walls, and a second end wall opposite the first end wall attached to the first and second side walls. A removable tape is attached to a nozzle plate of the ejection head and to a portion of the first side wall, wherein the removable tape comprises a polymeric backing film and a platinum-cured silicone adhesive.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: April 27, 2021
    Inventors: Paul W. Dryer, David C. Graham, Sean T. Weaver
  • Publication number: 20210011382
    Abstract: An improved photoimageable dry film formulation, a fluidic ejection head containing a thick film layer derived from the improved photoimageable dry film formulation, and a method for making a fluidic ejection head. The improved photoimageable dry film formulation includes a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying.
    Type: Application
    Filed: July 9, 2019
    Publication date: January 14, 2021
    Applicant: FUNAI ELECTRIC CO., LTD.
    Inventor: Sean T. WEAVER
  • Patent number: 10599034
    Abstract: A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first layer devoid of a hydrophobicity agent and (b) at least a second layer comprising the hydrophobicity agent. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: March 24, 2020
    Assignee: Funai Electric Co., Ltd.
    Inventors: David L. Bernard, Christopher A. Craft, David C. Graham, Sean T. Weaver
  • Publication number: 20190056660
    Abstract: A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first layer devoid of a hydrophobicity agent and (b) at least a second layer comprising the hydrophobicity agent. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 21, 2019
    Inventors: David L. BERNARD, Christopher A. CRAFT, David C. GRAHAM, Sean T. WEAVER
  • Patent number: 10031415
    Abstract: A three-dimensional (“3D”) structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: July 24, 2018
    Assignee: Funai Electric Co., Ltd.
    Inventors: David L. Bernard, Christopher A. Craft, David C. Graham, Sean T. Weaver
  • Patent number: 9962948
    Abstract: A fluidic delivery device having improved volumetric efficiency. The device includes a fluid container having a standpipe at a lower end of the container and open areas located below a fluid entrance end of the standpipe; a first fluid permeable body located in the fluid container above the fluid entrance end of the standpipe; and one or more second fluid permeable bodies located in the open areas of the fluid container below the first fluid permeable body and below the fluid entrance end of the standpipe.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: May 8, 2018
    Assignee: Funai Electric Co., Ltd.
    Inventors: David L. Bernard, Tim Frasure, Sean T. Weaver, Andrew L. McNees, David C. Graham
  • Patent number: 9855566
    Abstract: A fluid ejection head and a method of making a fluid ejection head. The method includes providing a semiconductor substrate containing a plurality fluid ejection actuators on a device surface thereof. The substrate is reactive ion etched to form one or more fluid supply vias therein. A flow feature layer is laminated to the substrate and is exposed to ultra violet (UV) radiation through a photo mask to provide UV exposed areas of the flow feature layer. The flow feature layer is heated to cross-link material in the UV exposed areas. A nozzle plate layer is laminated to the flow feature layer and exposed to UV radiation through a photo mask to provide UV exposed areas for nozzle holes. The nozzle plate layer is cross-linked with heat and the flow feature layer and nozzle plate layer are developed to form the flow features and nozzle holes in the respective layers.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: January 2, 2018
    Assignee: Funai Electric Co., Ltd.
    Inventors: Christopher A. Craft, David L. Bernard, Andrew L. McNees, Sean T. Weaver
  • Patent number: 9701119
    Abstract: A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: July 11, 2017
    Assignee: Funai Electric Co., Ltd.
    Inventors: David C. Graham, David B. Rhine, Sean T. Weaver, Christopher A. Craft
  • Publication number: 20150360466
    Abstract: A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.
    Type: Application
    Filed: June 12, 2014
    Publication date: December 17, 2015
    Inventors: David C. Graham, David B. Rhine, Sean T. Weaver, Christopher A. Craft
  • Patent number: 8491095
    Abstract: Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: July 23, 2013
    Assignee: Funai Electric Co., Ltd.
    Inventors: Andrew L. McNees, David L. Bernard, Paul W. Dryer, Sean T. Weaver, Eric S. Hall
  • Publication number: 20120229569
    Abstract: Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.
    Type: Application
    Filed: March 7, 2011
    Publication date: September 13, 2012
    Inventors: Andrew L. McNees, David L. Bernard, Paul W. Dryer, Sean T. Weaver, Eric S. Hall
  • Patent number: 8173031
    Abstract: Nozzle members, such as for a micro-fluid ejection head, micro-fluid ejection heads, and a method for making the same. One such nozzle member includes a negative photoresist composition derived from a first di-functional epoxy compound, a relatively high molecular weight polyhydroxy ether, a photoacid generator devoid of aryl sulfonium salts, an adhesion enhancer, and an aliphatic ketone solvent. The nozzle member has a thickness ranging from about 10 microns to about 30 microns.
    Type: Grant
    Filed: December 16, 2008
    Date of Patent: May 8, 2012
    Assignee: Lexmark International, Inc.
    Inventors: Sean T. Weaver, Rich Wells
  • Patent number: 8007990
    Abstract: Thick film layers for a micro-fluid ejection head, micro-fluid ejection heads, and methods for making micro-fluid ejection head and thick film layers. One such thick film layer is derived from a difunctional epoxy component having a weight average molecular weight ranging from about 2500 to about 4000 Daltons, a photoacid generator, an aryl ketone solvent, and an adhesion enhancing component. One such thick film layer has a cross-link density upon curing that increases the dimensional stability of the thick film layer sufficient to provide flow features therein having substantially vertical walls.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: August 30, 2011
    Assignee: Lexmark International, Inc.
    Inventors: Girish S. Patil, Sean T. Weaver, Rich Wells
  • Patent number: 7954927
    Abstract: An improved photoimaged nozzle plate for a micro-fluid ejection head, a micro-fluid ejection head containing the nozzle plate, and methods for making a micro-fluid ejection head. The improved nozzle plate is provided by a photoresist nozzle plate layer applied to a thick film layer on a semiconductor substrate containing fluid ejector actuators. The photoresist nozzle plate layer has a plurality of nozzle holes therein. Each of the nozzle holes are formed in the nozzle plate layer from an exit surface of the nozzle plate layer to an entrance surface of the nozzle plate layer. Each of the nozzle holes has a reentrant hole profile with a wall angle greater than about 4° up to about 30° measured from an axis orthogonal to a plane defined by the exit surface of the nozzle plate layer.
    Type: Grant
    Filed: February 1, 2008
    Date of Patent: June 7, 2011
    Assignee: Lexmark International, Inc.
    Inventors: Brian C. Hart, Gary A. Holt, Jr., Melissa M. Waldeck, Sean T. Weaver, Gary R. Williams
  • Patent number: 7905569
    Abstract: A substantially inorganic planarization layer for a micro-fluid ejection head substrate and method therefor. The planarization layer includes a plurality of layers composed of one or more dielectric compounds and at least one spin on glass (SOG) layer having a total thickness ranging from about 1 microns to about 15 microns deposited over a second metal layer of the micro-fluid ejection head substrate. A top most layer of the planarization layer is selected from one or more of the dielectric compounds and a hard mask material.
    Type: Grant
    Filed: September 15, 2004
    Date of Patent: March 15, 2011
    Assignee: Lexmark International, Inc.
    Inventors: Byron V. Bell, Craig M. Bertelsen, Brian C. Hart, Girish S. Patil, Sean T. Weaver