Patents by Inventor Sean T. Weaver
Sean T. Weaver has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958292Abstract: A composite photoresist material and method of making the composite photoresist material. The composite photoresist material includes: a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin.Type: GrantFiled: March 19, 2021Date of Patent: April 16, 2024Assignee: Funai Electric Co., Ltd.Inventor: Sean T. Weaver
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Publication number: 20240100851Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. An insert is adhesively fastened to the bottom wall. The insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively fastening an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. The insert is a material selected from an epoxy molding compound and a ceramic material. An ejection head chip is adhesively fastened to the die bond surface of the insert.Type: ApplicationFiled: December 1, 2023Publication date: March 28, 2024Applicant: Funai Electric Co., Ltd.Inventors: Masaki NAKATANI, Jason Vanderpool, Richard L. Warner, Sean T. Weaver
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Patent number: 11926157Abstract: A fluid ejection head for a fluid jet ejection device and a method for improving adhesion between a nozzle plate and a flow feature layer of the ejection head. The fluid ejection head includes a silicon substrate containing at least one array of fluid ejectors deposited thereon. At least one fluid supply via is etched through the silicon substrate adjacent to the at array of fluid ejectors. A flow feature layer is attached to the silicon substrate. The flow feature layer contains at fluid chambers and fluid flow channels corresponding the array of fluid ejectors for ejecting fluid provide fluid from the at least one fluid supply via to fluid chambers. At least a portion of the flow feature layer comprises an attachment surface having improved surface adhesion characteristics, and a nozzle plate containing nozzle holes is laminated to the flow feature layer to provide the fluid ejection head.Type: GrantFiled: March 5, 2021Date of Patent: March 12, 2024Assignee: Funai Electric Co., Ltd.Inventor: Sean T. Weaver
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Patent number: 11865843Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.Type: GrantFiled: November 9, 2021Date of Patent: January 9, 2024Inventors: Masaki Nakatani, Richard L. Warner, Sean T. Weaver
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Publication number: 20230364911Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes an array of nozzle holes and a fluid channel layer attached to an exposed surface of the nozzle plate, wherein the fluid channel layer comprises a fluid channel formed in the fluid channel layer adjacent to each nozzle hole for urging fluid from each nozzle hole.Type: ApplicationFiled: May 11, 2022Publication date: November 16, 2023Applicant: FUNAI ELECTRIC CO., LTDInventors: David C. Graham, Sean T. Weaver
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Publication number: 20230364908Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes at least two arrays of nozzle holes on opposing sides of a fluid supply via etched in an ejection head substrate and a photoresist layer attached to an exposed surface of the nozzle plate spanning a section of the nozzle plate between the at least two arrays of nozzle holes. The photoresist layer increases a thickness of the nozzle plate between the at least two arrays of nozzle holes to greater than 25 microns up to about 100 microns.Type: ApplicationFiled: May 11, 2022Publication date: November 16, 2023Applicant: FUNAI ELECTRIC CO., LTDInventors: David C. Graham, Sean T. Weaver
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Patent number: 11815812Abstract: A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.Type: GrantFiled: November 30, 2021Date of Patent: November 14, 2023Inventors: David C. Graham, Joel P. Provence, Sean T. Weaver, Richard D. Wells
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Publication number: 20230249190Abstract: A method of generating a microfluidic ejection chip is provided. The method includes creating an opening in a silicon substrate through multiple iterations of a deep reactive ion etching process, forming a passivation layer over any exposed portion of silicon at the opening following each iteration of the deep reactive ion etching of the silicon substrate, and not removing the passivation layer at a conclusion of the etching of the silicon substrate to define a fluid passageway at the opening in the silicon substrate, such that the passivation layer is permanent on the silicon substrate at the opening.Type: ApplicationFiled: April 21, 2023Publication date: August 10, 2023Applicant: FUNAI ELECTRIC CO., LTD.Inventors: David L. Bernard, Sean T. Weaver
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Patent number: 11666918Abstract: A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.Type: GrantFiled: March 6, 2020Date of Patent: June 6, 2023Assignee: FUNAI ELECTRIC CO., LTD.Inventors: David L. Bernard, Sean T. Weaver
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Publication number: 20230168580Abstract: A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.Type: ApplicationFiled: November 30, 2021Publication date: June 1, 2023Applicant: Funai Electric Co., Ltd.Inventors: David C. Graham, Joel P. PROVENCE, Sean T. Weaver, Richard D. Wells
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Publication number: 20230143469Abstract: A fluid cartridge having a plastic fluid body, a bottom wall having a fluid supply opening therein. A metal insert is adhesively attached to the bottom wall. The metal insert has a fluid supply slot therein corresponding to the fluid supply opening in the bottom wall, a die bond surface adjacent to the fluid supply slot for adhesively attaching an ejection head chip thereto, and a plurality of air vents adjacent to the die bond surface. An ejection head chip is adhesively attached to the die bond surface of the metal insert.Type: ApplicationFiled: November 9, 2021Publication date: May 11, 2023Applicant: Funai Electric Co., Ltd.Inventors: Masaki NAKATANI, Richard L. Warner, Sean T. Weaver
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Patent number: 11577513Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.Type: GrantFiled: October 6, 2020Date of Patent: February 14, 2023Inventor: Sean T. Weaver
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Patent number: 11571896Abstract: A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones.Type: GrantFiled: February 1, 2021Date of Patent: February 7, 2023Inventors: Michael A. Marra, III, Sean T. Weaver
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Publication number: 20220297428Abstract: A composite photoresist material and method of making the composite photoresist material. The composite photoresist material includes: a photoresist layer devoid of a phenoxy resin, and a photoresist layer containing a phenoxy resin.Type: ApplicationFiled: March 19, 2021Publication date: September 22, 2022Applicant: Funai Electric Co., Ltd.Inventor: Sean T. Weaver
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Publication number: 20220281224Abstract: A fluid ejection head for a fluid jet ejection device and a method for improving adhesion between a nozzle plate and a flow feature layer of the ejection head. The fluid ejection head includes a silicon substrate containing at least one array of fluid ejectors deposited thereon. At least one fluid supply via is etched through the silicon substrate adjacent to the at array of fluid ejectors. A flow feature layer is attached to the silicon substrate. The flow feature layer contains at fluid chambers and fluid flow channels corresponding the array of fluid ejectors for ejecting fluid provide fluid from the at least one fluid supply via to fluid chambers. At least a portion of the flow feature layer comprises an attachment surface having improved surface adhesion characteristics, and a nozzle plate containing nozzle holes is laminated to the flow feature layer to provide the fluid ejection head.Type: ApplicationFiled: March 5, 2021Publication date: September 8, 2022Applicant: FUNAI ELECTRIC CO., LTDInventor: Sean T. Weaver
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Patent number: 11433681Abstract: A fluidic ejection cartridge and protective tape therefor. The cartridge includes a cartridge body for an organic solvent-based fluid having a cover closing a first end thereof, an ejection head on a second end thereof and side walls attached to the first and second ends between the first and second ends. The side walls include a first side wall, a second side wall opposite the first side wall, a first end wall attached to the first and second side walls, and a second end wall opposite the first end wall attached to the first and second side walls. A removable tape is attached to a nozzle plate of the ejection head and to a portion of the first side wall. The removable tape contains a polymeric backing film and a glass-filled, platinum-cured silicone adhesive. The glass-filled, platinum-cured silicone adhesive is cross-linked with silane and a second cross-linking agent.Type: GrantFiled: March 9, 2021Date of Patent: September 6, 2022Assignee: Funai Electric Co., Ltd.Inventors: Jacob Boyle, Paul W. Dryer, David C. Graham, Sean T. Weaver
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Publication number: 20220242124Abstract: A method of forming a print head, by forming a heater chip. Via zones having peripheries are defined on a substrate, with heaters formed along the entire peripheries of the via zones. Traces that electrically connect to each of the heaters are formed. In some embodiments, the heater chip is then stored for a period of time. After storing the heater chip, vias are formed in only a selected portion of the via zones, which is a subset of the via zones. A channel layer is formed on the heater chip by forming a first layer on the heater chip. Flow channels are formed in the first layer from the vias to only those heaters on the heater chip that are disposed along the selected portion of the via zones. Bubble chambers are formed in the first layer around only those heaters on the heater chip that are disposed along the selected portion of the via zones.Type: ApplicationFiled: February 1, 2021Publication date: August 4, 2022Applicant: Funai Electric Co., Ltd.Inventors: Michael A. Marra, III, Sean T. WEAVER
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Patent number: 11340529Abstract: An improved photoimageable dry film formulation, a fluidic ejection head containing a thick film layer derived from the improved photoimageable dry film formulation, and a method for making a fluidic ejection head. The improved photoimageable dry film formulation includes a multifunctional epoxy compound, a photoinitiator capable of generating a cation, a non-photoreactive solvent, and from about 0.5 to about 5% by weight a silane oligomer adhesion enhancer based on a total weight of the photoimageable dry film formulation before drying.Type: GrantFiled: July 9, 2019Date of Patent: May 24, 2022Inventor: Sean T. Weaver
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Publication number: 20220105724Abstract: A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.Type: ApplicationFiled: October 6, 2020Publication date: April 7, 2022Applicant: Funai Electric Co., Ltd.Inventor: Sean T. WEAVER
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Publication number: 20210276015Abstract: A microfluidic ejection chip includes a silicon substrate having a fluid passageway. The fluid passageway is defined by a silicon sidewall of the silicon substrate that is covered by a permanent passivation layer to protect the silicon sidewall from exposure to an acidic fluid. The permanent passivation layer is retained on the silicon sidewall at a conclusion of etching of the silicon substrate to form the fluid passageway.Type: ApplicationFiled: March 6, 2020Publication date: September 9, 2021Inventors: David L. Bernard, Sean T. Weaver