Abstract: Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

Abstract: A fluid tank for micro-fluid ejection devices is provided. The fluid tank includes housing with an interior surface coating. The interior surface coating has a highly hydrophobic to super hydrophobic surface with water contact angle of greater than about 120° and surface energy of less than about 20 mJ/m2. The interior surface coating includes nanoparticles and hydrophobic materials. The fluid tank is suitable as ink container having ink level measurement system, and allows an accurate and quickly responsive ink level measurement system.

Abstract: Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

Abstract: Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

Abstract: The present disclosure relates to photoresist compositions suitable for thin layer photoimageable nozzle plates for micro-fluid ejection devices and methods of making and using such thin layer nozzle plates. The photoresist compositions may comprise a high-molecular weight phenoxy resin, a di-functional epoxy resin, and a multi-functional epoxy resin.

Abstract: A nozzle plate for a micro-fluid ejection head, a method of making a hydrophobic nozzle plate, and a method for improving the resiliency of a nozzle plate. The nozzle has a photoimageable hydrophobic polycyclic polyolefin layer derived from an epoxy functionalized polynorbornene.

Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

Abstract: The present disclosure relates to photoresist compositions suitable for thin layer photoimageable nozzle plates for micro-fluid ejection devices and methods of making and using such thin layer nozzle plates. The photoresist compositions may comprise a high-molecular weight phenoxy resin, a di-functional epoxy resin, and a multi-functional epoxy resin.

Abstract: A nozzle plate for a micro-fluid ejection head, a method of making a hydrophobic nozzle plate, and a method for improving the resiliency of a nozzle plate. The nozzle has a photoimageable hydrophobic polycyclic polyolefin layer derived from an epoxy functionalized polynorbornene.

Abstract: A method for making a dry film photoresist layer for a micro-fluid ejection head and a micro-fluid ejection head made by the method. The method includes applying a photoimageable liquid to a moving web of release material to provide a photoimageable layer on the release material using a slot die coater. The layer on the release material has a coating thickness ranging from about 8 to about 25 microns with a thickness variation of no more than about one micron. The photoimageable layer on the web is dried to provide a dry film photoresist layer. A protective web is then applied to the dry film photoresist layer.

Abstract: Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

Abstract: A jet head box for a semiconductor substrate and nozzle plate containing fluid jet actuators. The jet head box includes an elongate substantially rigid body having a first surface and a second surface opposite the first surface. The body also includes a first recessed portion defining a substrate pocket area in the first surface thereof. An elongate slot extends through the body from the second surface to the first surface in the substrate pocket area. An encapsulant dam is provided adjacent at least one end thereof. A shelf is adjacent the encapsulant dam. The jet head box provides a low cost construction for simple miniature fluid jetting devices.

Abstract: A jet head box for a semiconductor substrate and nozzle plate containing fluid jet actuators. The jet head box includes an elongate substantially rigid body having a first surface and a second surface opposite the first surface. The body also includes a first recessed portion defining a substrate pocket area in the first surface thereof. An elongate slot extends through the body from the second surface to the first surface in the substrate pocket area. An encapsulant dam is provided adjacent at least one end thereof. A shelf is adjacent the encapsulant dam. The jet head box provides a low cost construction for simple miniature fluid jetting devices.