Abstract: Systems, apparatuses, semiconductor products and methods for semiconductor packages, specifically under chip bridge system-in-packages, are provided that allow one or more bridges to connect two or more dies. For example, high density connections of two or more dies may be connected with an under chip bridge, all of which may be placed on a substrate to form a system-in-package semiconductor package. Various embodiments include methods of manufacturing such packages that include utilizing a flat semiconductor along with bumping operations that may use single sizes of bumping.

Abstract: A flexible semiconductor package is formed by interposing a flexible substrate between a tungsten stiffener and a die. A tungsten stiffener is bonded to a first surface of the flexible substrate prior to flip chip bonding or die attach of a die to a second surface of the flexible substrate. The tungsten stiffener is dimensioned so as to substantially overlap the die and provide a rigid and flat surface on which the die/flexible substrate bonding occurs. The flat and rigid characteristic of a tungsten stiffener optimizes the electrical and mechanical bond between the die and the flexible substrate as well as minimizing CTE mismatch.

Abstract: A flexible semiconductor package is formed by interposing a flexible substrate between a tungsten stiffener and a die. A tungsten stiffener is bonded to a first surface of the flexible substrate prior to flip chip bonding or die attach of a die to a second surface of the flexible substrate. The tungsten stiffener is dimensioned so as to substantially overlap the die and provide a rigid and flat surface on which the die/flexible substrate bonding occurs. The flat and rigid characteristic of a tungsten stiffener optimizes the electrical and mechanical bond between the die and the flexible substrate as well as minimizing CTE mismatch.

Abstract: A photodiode detector array is bonded to a first surface of a first substrate and electrically coupled to the second surface of the first substrate. A shield, opaque to X-ray radiation is attached to the second surface of the first substrate. A processing chip is flip chip bonded and electrically coupled to the first surface of the second substrate. A portion of the first surface of the second substrate is physically and electrically joined to a portion of the second surface of the first substrate so as to allow processing of electrical signals from the photodiode array. The shield associated with the first substrate is aligned so as to prevent X-ray radiation from reaching the processing chip associated with second substrate. The shield and the processing chip are separated by an air space providing thermal and electrical isolation.