Abstract: A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.

Abstract: There is provided a drive carrier. The drive carrier is configured to receive a media drive and is also configured to be removably receivable in a receiving location of a computer system. The drive carrier includes a base portion, a handle portion and a latch mechanism for securing the carrier within the receiving location. The base portion and the handle portion are configured to co-operate to operate the latch mechanism on insertion and/or removal of the carrier from the receiving location, for inserting and/or removing the carrier from the receiving location and operating the latch mechanism with a single movement of the handle portion.

Abstract: A rack-mounted assembly (10) comprises one or more racks, each capable of containing one or more printed circuit boards (PCB) (18), interconnected by a backplane (15) which is located along the bottom of a shelf (14). This position of the backplane (15) allows the rear wall of the rack-mounted assembly to be perforated, thereby permitting a cooling airflow for the PCBs to pass in through the front of the assembly and then out through the back. An insertion mechanism is provided to allow a PCB to be inserted into a rack. To achieve this, the PCB must first travel backwards into the rack-mounted assembly, and then downwards into engagement with the backplane (15). In one embodiment, this is accomplished by supporting the PCB from a hanger (100) which moves in and out of the rack-mounted assembly along a guide rail (45). The hanger includes slots (15) that retain pins (110) from the PCB. The slots are orientated diagonally upwards and backwards.

Abstract: An electronics assembly, for example a computer that may be employed as a network server, has an enclosure, and a plurality of heat-generating components such as microprocessors located inside the enclosure. One or more fans may be provided for maintaining a through flow of air for cooling the components of the assembly. The heat-generating components are located within the enclosure in line with the direction of the flow of air, and the heat-sinks have a configuration such that the air flows over them in parallel. The heat-sinks may each have a flat base for mounting on the component, and a cantilevered portion having one end located on the base, and another end that extends beyond the base and over the base of the other heat-sink, but not in contact with it.