Patents by Inventor Sebastian BENGSCH

Sebastian BENGSCH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200068718
    Abstract: The invention relates to a method for applying an electrical microstructure on or in an object of any type, wherein the electrical microstructure is first applied to a flexible film and the film is fastened, with the electrical microstructure applied thereto in front, to a fastening surface of the object by adhesive bonding and/or vulcanization attachment. The invention further relates to an elastomer structure, to a fiber composite component, and to a motor-vehicle tire, each having at least one electrical microstructure fastened thereto by adhesive bonding and/or vulcanization attachment.
    Type: Application
    Filed: November 21, 2017
    Publication date: February 27, 2020
    Inventors: Hans Jürgen MAIER, Marc Christopher WURZ, Sebastian BENGSCH