Patents by Inventor Sebastian CLÄRDING

Sebastian CLÄRDING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat transfer device for producing a soldered connection of electrical components
    Patent number: 11351623
    Abstract: A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: June 7, 2022
    Assignee: PINK GMBH THERMOSYSTEME
    Inventors: Christoph Oetzel, Sebastian Clärding
  • HEAT TRANSFER DEVICE FOR PRODUCING A SOLDERED CONNECTION OF ELECTRICAL COMPONENTS
    Publication number: 20200180058
    Abstract: A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.
    Type: Application
    Filed: February 10, 2020
    Publication date: June 11, 2020
    Applicant: PINK GMBH THERMOSYSTEME
    Inventors: Christoph OETZEL, Sebastian CLÄRDING
  • Heat transfer device for producing a soldered connection of electrical components
    Patent number: 10596649
    Abstract: A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: March 24, 2020
    Assignee: PINK GMBH THERMOSYSTEME
    Inventors: Christoph Oetzel, Sebastian Clärding
  • HEAT TRANSFER DEVICE FOR PRODUCING A SOLDERED CONNECTION OF ELECTRICAL COMPONENTS
    Publication number: 20170326665
    Abstract: A heat transfer device for thermal coupling of a component to be soldered, having a heat source and/or a heat sink in a soldering machine, with at least one base plate which is designed to be in thermal contact at least with the heat source and/or the heat sink. The base plate has a plurality of contact units having a respective contact surface, where the contact surfaces are thermally contactable to the components. The contact units are designed in such a way that the relative distances between the contact surfaces and the surface of the base plate facing the component are changeable. A soldering device, in particular a vacuumable soldering device, is provided having at least one such heat transfer device.
    Type: Application
    Filed: December 9, 2015
    Publication date: November 16, 2017
    Applicant: PINK GMBH THERMOSYSTEME
    Inventors: Christoph OETZEL, Sebastian CLÄRDING