Abstract: The present invention relates to a method for plasma-treating a surface of a substrate, in particular a dielectric substrate, the method including the following steps: (t) wet-chemical treating the surface of the substrate with treatment solutions of a desmear process, to obtain a wet-chemical treated surface of the substrate, (i) treating a surface of the substrate with a plasma beam under atmospheric pressure, to obtain a plasma-treated surface of the substrate, (ii) activation of the plasma-treated surface of the substrate with an activation composition, to obtain an activated surface of the substrate, (iii) optionally electroless deposition of a coating metal on the activated surface of the substrate, to obtain a plating surface of the substrate, and (iv) optionally electrolytic deposition of an additional coating metal on the plating surface of the substrate obtained after optional step (iii) or on the activated surface of the substrate obtained after step (ii).

Abstract: To ensure a uniform flow over the surface of a product W, an apparatus is provided for the wet chemical treatment of the product W that is disposed in the apparatus 100. This apparatus comprises at least one flow member 150 that includes respectively at least one paddle-like flow element 155, wherein at least one flow member 155 is disposed situated opposite the surface of the product W and is moveable substantially parallel to the surface of the product W.

Abstract: To ensure a uniform flow over the surface of a product W, an apparatus is provided for the wet chemical treatment of the product W that is disposed in the apparatus 100. This apparatus comprises at least one flow member 150 that includes respectively at least one paddle-like flow element 155, wherein at least one flow member 155 is disposed situated opposite the surface of the product W and is moveable substantially parallel to the surface of the product W.

Abstract: In order to regenerate permanganate solutions being utilized for the etching and roughening of plastics surfaces electrolytic methods are known. Though relatively small quantaties of by-products are produced with these methods as compared to chemical regeneration methods, large quantaties of manganese dioxide are produced when printed circuit boards are treated. In order to avoid formation of manganese dioxide during the regeneration method a novel cathode 2 has been found which is provided with a porous, electrically nonconducting layer 7 on the cathode body 3. The layer 7 preferably consists of a plastics material being resistant to acid and/or alkali.

Abstract: In order to regenerate permanganate solutions being utilized for the etching and roughening of plastics surfaces electrolytic methods are known. Though relatively small quantaties of by-products are produced with these methods as compared to chemical regeneration methods, large quantaties of manganese dioxide are produced when printed circuit boards are treated. In order to avoid formation of manganese dioxide during the regeneration method a novel cathode 2 has been found which is provided with a porous, electrically nonconducting layer 7 on the cathode body 3. The layer 7 preferably consists of a plastics material being resistant to acid and/or alkali.