Abstract: Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises i) 30 to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5 to 20% by weight, based on its total weight, of at least one low-molecular carboxylic acid; and iii) 0.4 to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molecular weight distribution of 45 to 70% by area in the molecular weight range of 150 to 550 and of 30 to 55% by area in the molecular weight range of >550 to 10,000 in the combined GPC.

Abstract: Alloy comprising 90 to 96.8 wt. % of tin; 0.1 to 2.0 wt. % of silver; 2.0 to 4.0 wt. % of bismuth; 1.0 to 2.0 wt. % of antimony; 0.1 to 1.0 wt. % of copper; and 0.01 to 1 wt. % of germanium.

Abstract: Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises i) 30 to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5 to 20% by weight, based on its total weight, of at least one low-molecular carboxylic acid; and iii) 0.4 to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molecular weight distribution of 45 to 70% by area in the molecular weight range of 150 to 550 and of 30 to 55% by area in the molecular weight range of >550 to 10,000 in the combined GPC.

Abstract: Processes for forming an electric heater comprise providing a heater element and a power supply, applying a layer of a diffusion solder paste onto the heater element and/or the power supply and drying the applied diffusion solder paste, arranging the heater element and the power supply such that the heater element and the power supply contact each other via the dried diffusion solder paste, and diffusion soldering the arrangement to form a connection between the heater element and the power supply. The diffusion solder paste comprises or consists of 10-30 wt.-% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, 60-80 wt.-% of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and 3-30 wt.-% of a solder flux.

Abstract: A process for forming an electric heater comprising the steps: (a) providing a heater element and a power supply, (b) applying a layer of a copper paste onto the heater element and/or the power supply and drying the applied layer of copper paste, (c1) applying a solder agent onto the dried copper paste and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste and the solder agent or (c2) appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste, and applying a solder agent next to the dried copper paste or (c3) if in step (b) the copper paste has been applied only onto the heater element and then dried, applying a solder agent onto the power supply and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by me

Abstract: A process for forming an electric heater comprising the steps: (a) providing a heater element and a power supply, (b) applying a layer of a copper paste onto the heater element and/or the power supply and drying the applied layer of copper paste, (c1) applying a solder agent onto the dried copper paste and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste and the solder agent or (c2) appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by means of the dried copper paste, and applying a solder agent next to the dried copper paste or (c3) if in step (b) the copper paste has been applied only onto the heater element and then dried, applying a solder agent onto the power supply and appropriately arranging the heater element and the power supply such that the heater element and the power supply contact each other by me

Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.

Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Abstract: An electrically conductive composition as an electrically conductive adhesive for mechanically and electrically connecting at least one contact of a solar cell with an electrical conductor is provided. The contact is selected from emitter contacts and collector contacts and the electrically conductive composition contains (A) 2 to 35 vol.-% silver particles having an average particle size of 1 to 25 ?m and exhibiting an aspect ratio in the range of 5 to 30:1, (B) 10 to 63 vol.-% non-metallic particles having an average particle size of 1 to 25 ?m and exhibiting an aspect ratio in the range of 1 to 3:1, (C) 30 to 80 vol.-% of a curable resin system, and (D) 0 to 10 vol.-% of at least one additive, in which the sum of the vol.-% of particles (A) and (B) totals 25 to 65 vol.-%.

Abstract: An electrically conductive composition as an electrically conductive adhesive for mechanically and electrically connecting at least one contact of a solar cell with an electrical conductor is provided. The contact is selected from emitter contacts and collector contacts and the electrically conductive composition contains (A) 2 to 35 vol.-% silver particles having an average particle size of 1 to 25 ?m and exhibiting an aspect ratio in the range of 5 to 30:1, (B) 10 to 63 vol.-% non-metallic particles having an average particle size of 1 to 25 um and exhibiting an aspect ratio in the range of 1 to 3:1, (C) 30 to 80 vol.-% of a curable resin system, and (D) 0 to 10 vol.-% of at least one additive, in which the sum of the vol.-% of particles (A) and (B) totals 25 to 65 vol.-%.

Abstract: An electrically conductive composition containing: (A) 2 to 35 vol.-% electrically conductive particles having an average particle size in the range of 1 to 25 ?m and exhibiting an aspect ratio in the range of 5 to 30:1, (B) 10 to 70 vol.-% non-metallic particles having an average particle size in the range of 1 to 25 ?m, exhibiting an aspect ratio in the range of 1 to 3:1, (C) 30 to 80 vol.-% of a curable resin system, and (D) 0 to 10 vol.-% of at least one additive, in which the sum of the vol.-% of particles (A) and (B) totals 25 to 65 vol.-%.

Abstract: A method for making a firmly-bonded connection involves a) providing an electronic component and a substrate having surfaces to be connected; b) applying a copper paste onto at least one of the surfaces and drying the layer of copper paste; c1) applying a solder agent onto the copper paste and arranging the component and the substrate in contact via the combination of copper paste and solder agent; or c2) arranging the component and the substrate in contact via the dried copper paste, and applying a solder agent next to the layer of dried copper paste; and d) soldering the arrangement. The copper paste contains (i) particles of copper, copper-rich copper/zinc alloy, and/or copper-rich copper/tin alloy containing a phosphorus fraction of 0 to ?500 wt-ppm, (ii) solder particles which are tin, tin-rich tin/copper alloy, tin-rich tin/silver alloy, and/or tin-rich tin/copper/silver alloy, and (iii) vehicle.

Abstract: A solder paste that contains or consists of (i) 10-30% by weight of at least one type of particles that each contain a phosphorus fraction of >0 to ?500 wt-ppm and are selected from copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 60-80% by weight of at least one type of particles selected from tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 3-30% by weight solder flux, in which the mean particle diameter of metallic particles (i) and (ii) is ?15 ?m.

Abstract: A method for mounting an electronic component on a substrate is provided. The method involves the use of a solder paste that includes a mixture of organic dicarboxylic acids. The thickness of the solder deposit is 25 to 200 ?m.

Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.

Abstract: A door hinge comprises a first hinge element fastenable to a door frame and a second hinge element fastenable to a door leaf and includes first and second hinge blade. A first pivot axis is connected, when the door hinge is in a first operating condition, to first and second hinge elements such that the second hinge blade is pivotable relative to the first hinge element, in a first pivot direction, for unblocking a door aperture. The first pivot axis is decoupled from the first or the second hinge element when the door hinge is in a second operating condition. A second pivot axis is connected to the first and second hinge elements such that said first and second hinge elements are pivotable relative to one another, in a second pivot direction which is opposed to the first pivot direction, for unblocking the door aperture.

Abstract: The invention is directed to a process for manufacture of fine precious metal containing particles, specifically silver-based particles and silver-based contact materials via an intermediate silver(+1)-oxide species. The process comprises in a first step the formation of a thermally instable silver (+1)-oxide species by adding a base to an aqueous silver salt solution comprising an organic dispersing agent. Due to the presence of the organic dispersing agent, the resulting silver (+1)-oxide species is thermally instable, thus the species is decomposing to metallic silver at temperature lower than 100° C. The process optionally may comprise the addition of a powdered compound selected from the group of inorganic oxides, metals, and carbon-based compounds. Furthermore the process may contain additional separating and drying steps. The process is versatile, cost efficient and environmentally friendly and is used for the manufacture of silver-based particles and electrical contact materials.

Abstract: A door hinge (10) according to the invention comprises a first hinge element (12) which is fastenable to a door frame (24) and a second hinge element (14) which is fastenable to a door leaf (28) and has a first hinge blade (20) and a second hinge blade (22). A first pivot axis (32) is connected, when the door hinge (10) is in a first operating condition, to the first and second hinge elements (12, 14) in such a way that the second hinge blade (22) of the second hinge element (14) is pivotable, when the door hinge (10) is in said first operating condition, about said first pivot axis (32), relative to the first hinge element (12), in a first pivot direction (Px), for the purpose of unblocking a door aperture which is bounded by the door frame (24). The first pivot axis (32) is decoupled from the first or the second hinge element (12, 14) when the door hinge (10) is in a second operating condition.

Abstract: The invention is directed to a process for manufacture of fine precious metal containing particles, specifically silver-based particles and silver-based contact materials via an intermediate silver(+1)-oxide species. The process comprises in a first step the formation of a thermally instable silver (+1)-oxide species by adding a base to an aqueous silver salt solution comprising an organic dispersing agent. Due to the presence of the organic dispersing agent, the resulting silver (+1)-oxide species is thermally instable, thus the species is decomposing to metallic silver at temperature lower than 1000° C. The process optionally may comprise the addition of a powdered compound selected from the group of inorganic oxides, metals, and carbon-based compounds. Furthermore the process may contain additional separating and drying steps. The process is versatile, cost efficient and environmentally friendly and is used for the manufacture of silver-based particles and electrical contact materials.