Abstract: A moulding composition, comprising at least 40 wt. % of the following components: a) 60 to 99 parts by wt. of a partially aromatic copolyamide which comprises as polymerized monomer units: I. 30 to 90 mol % of a combination of hexamethylenediamine and terephthalic acid; and II. 70 to 10 mol % of a combination of hexamethylenediamine and a linear aliphatic dicarboxylic acid with 8 to 19 C atoms; and b) 40 to 1 parts by wt. of an olefinic copolymer comprising as polymerized monomer units: i) 35 to 94.9 wt. % of ethene-based monomer units, ii) 5 to 65 wt. % of monomer units based on a 1-alkene with 4 to 8 C atoms, iii) 0 to 10 wt. % of monomer units based on an olefin different from i) and ii), and iv) 0.1 to 2.5 wt. % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride, wherein the sum of the wt. % values of i), ii), iii) and iv) is 100%, and the sum of the parts by wt.