Patents by Inventor Sebastian Gepp

Sebastian Gepp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10847692
    Abstract: A foil structure with generation of visible light via LED technology has a carrier foil and an LED chip for generation of UV light. The LED chip is disposed on a first portion of the carrier foil and is provided with a light output face for emission of the UV light. The foil structure further has a color reaction layer for conversion of the UV light into the visible light, wherein the color reaction layer is disposed on a second portion of the carrier foil. The carrier foil is folded over in such a way that the second portion of the carrier foil is disposed above the first portion of the carrier foil and the color reaction layer is disposed above the LED chip or in a manner laterally offset relative to the LED chip.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: November 24, 2020
    Assignee: Schreiner Group GmbH & Co. KG
    Inventors: Johannes Becker, Sebastian Gepp, Manfred Hartmann, Hartmut Wiederrecht
  • Patent number: 10760771
    Abstract: A foil structure with generation of visible light using LED technology includes a carrier foil and an LED chip for generation of UV light. The LED chip is disposed on the carrier foil and is provided with a light output face for emission of the UV light. Furthermore, the foil structure includes a color reaction layer for conversion of the UV light into the visible light. The color reaction layer is disposed above the LED chip or in a manner laterally offset relative to the LED chip. The color reaction layer is provided with a structuring, so that the UV light emitted from the light output face of the LED chip is not emitted into the surroundings of the foil structure.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: September 1, 2020
    Assignee: Schreiner Group GmbH & Co. KG
    Inventors: Johannes Becker, Sebastian Gepp, Manfred Hartmann, Hartmut Wiederrecht
  • Publication number: 20190045620
    Abstract: A sensor device for integration in an electrical circuit includes a support layer (12?), which is formed with a release layer; at least one flexible insulating layer (14?, 32), which is made using a printing method; and at least one flexible electrical conductor structure (20?, 34), which is applied with a printing method onto the insulating layer (14). The insulating layer (14?, 32) and the conductor structure (20?, 34) form a flexible unit, which is removable without damage from the support layer (12?).
    Type: Application
    Filed: October 7, 2018
    Publication date: February 7, 2019
    Inventors: Peter Seidl, Sebastian Gepp, Thomas Weik, Manfred Hartmann
  • Publication number: 20190006062
    Abstract: A foil structure with electrical functionality and external contacting includes a region containing an electrical transmission path and a contacting region for the external contacting of the electrical transmission path. At least one electrically conductive layer, which is provided with a material mixture of silver and carbon, is contained in the contacting region of the foil structure. The electrically conductive layer can be extended from the contacting region of the foil structure into the region containing the electrical transmission path and can form the electrical transmission path. The electrically conductive layer can be disposed on a conductor track in the contacting region. The electrically conductive layer is mechanically and climatically stable by virtue of the mixture of silver and carbon.
    Type: Application
    Filed: June 20, 2018
    Publication date: January 3, 2019
    Applicant: Schreiner Group GmbH & Co. KG
    Inventors: André KALIO, Sebastian GEPP, Verena HARTIG, Annette BARTH, Marina WITTENBERG
  • Publication number: 20180366627
    Abstract: A foil structure with generation of visible light via LED technology has a carrier foil and an LED chip for generation of UV light. The LED chip is disposed on a first portion of the carrier foil and is provided with a light output face for emission of the UV light. The foil structure further has a color reaction layer for conversion of the UV light into the visible light, wherein the color reaction layer is disposed on a second portion of the carrier foil. The carrier foil is folded over in such a way that the second portion of the carrier foil is disposed above the first portion of the carrier foil and the color reaction layer is disposed above the LED chip or in a manner laterally offset relative to the LED chip.
    Type: Application
    Filed: June 18, 2018
    Publication date: December 20, 2018
    Applicant: Schreiner Group GmbH & Co. KG
    Inventors: Johannes BECKER, Sebastian GEPP, Manfred HARTMANN, Hartmut WIEDERRECHT
  • Publication number: 20180363883
    Abstract: A foil structure with generation of visible light using LED technology includes a carrier foil and an LED chip for generation of UV light. The LED chip is disposed on the carrier foil and is provided with a light output face for emission of the UV light. Furthermore, the foil structure includes a color reaction layer for conversion of the UV light into the visible light. The color reaction layer is disposed above the LED chip or in a manner laterally offset relative to the LED chip. The color reaction layer is provided with a structuring, so that the UV light emitted from the light output face of the LED chip is not emitted into the surroundings of the foil structure.
    Type: Application
    Filed: June 18, 2018
    Publication date: December 20, 2018
    Applicant: Schreiner Group GmbH & Co. KG
    Inventors: Johannes BECKER, Sebastian GEPP, Manfred HARTMANN, Hartmut WIEDERRECHT
  • Patent number: 10098223
    Abstract: A sensor device for integration in an electrical circuit, including a support layer (12?), which is formed with a release layer; at least one flexible insulating layer (14?, 32), which is made using a printing method; and at least one flexible electrical conductor structure (20?, 34), which is applied with a printing method onto the insulating layer (14). The insulating layer (14?, 32) and the conductor structure (20?, 34) form a flexible unit, which is removable without damage from the support layer (12?).
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: October 9, 2018
    Assignee: SCHREINER GROUP GMBH & CO. KG
    Inventors: Peter Seidl, Sebastian Gepp, Thomas Weik, Manfred Hartmann