Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.

Abstract: The invention relates to a method for optically representing electronic semiconductor components 2 on structural units 1 as used for contacting semiconductor components, and to a device which can be used for this purpose. The aim of the invention is to improve navigation on the structural unit 1. Regarding the structural unit 1 provided on a holding surface 19 of a holding device 18, a graphical representation 4 of the structural unit 1 or its semiconductor component 2, or of a section thereof, is provided, and a live image 3 of the semiconductor component 2 is displayed on a first display unit 33. A first graphical representation 4 is also displayed on the first display unit 33 in such a way that elements of the first graphical representation 4, referred to as overlays 5, superimpose the live image 3. The first graphical representation 4 is synchronized with the live image 3 in a computer-aided manner such that at least one overlay 5 corresponds to the associated element of the live image 3.

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

Abstract: An optical path correction subassembly, an optical detection assembly, and an optical detection system are provided. The optical path correction subassembly can be optionally configured to be applied to a light detector. The optical path correction subassembly includes a holder structure and an optical path correction structure carried by the holder structure, and the optical path correction structure has a light beam guiding surface arranged as a reverse inclination inclined relative to a vertical line. The light beam guiding surface of the optical path correction structure can be configured to effectively or accurately guide a predetermined light beam to a light receiving surface of the light detector so as to facilitate collection of the predetermined light beam. The light beam guiding surface of the optical path correction structure can be arranged at an acute angle relative to the light receiving surface of the light detector.

Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.

Abstract: An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Abstract: A probe station includes a base, a adaptor, a probe holder and a probe. The adaptor has a first portion and a second portion away from the first portion towards a first direction by a first length. The first portion connects to the base. A probe holder connects to the second portion and extends towards a second direction opposite to the first direction by a second length. The probe connects to an end of the probe holder away from the second portion and extends towards the second direction by a third length. A product of a thermal coefficient of the adaptor and the first length is equal to a sum of a product of a thermal coefficient of the probe holder and the second length and a product of a thermal coefficient of the probe and the third length.

Abstract: A probe station includes a base, a adaptor, a probe holder and a probe. The adaptor has a first portion and a second portion away from the first portion towards a first direction by a first length. The first portion connects to the base. A probe holder connects to the second portion and extends towards a second direction opposite to the first direction by a second length. The probe connects to an end of the probe holder away from the second portion and extends towards the second direction by a third length. A product of a thermal coefficient of the adaptor and the first length is equal to a sum of a product of a thermal coefficient of the probe holder and the second length and a product of a thermal coefficient of the probe and the third length.

Abstract: A method of positioning probe tips relative to pads includes: focusing on each of the probe tips in a first image as viewed by a microscope and collecting the coordinates of the corresponding probe tip relative to a first reference point in the first image; focusing on each of the pads in a second image as viewed by the microscope and collecting the coordinates of the corresponding pad relative to a second reference point in the second image, a relative position of the second reference point to the first reference point being predetermined; matching the pads with the probe tips when the quantity of the probe tips and the pads are equal while minimizing a maximum value of the distances calculated between each of the probe tips and the corresponding pad; and moving the probe tips to touch the pads with the maximum value minimized.

Abstract: A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.

Abstract: A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.

Abstract: The invention relates to a method for optically representing electronic semiconductor components 2 on structural units 1 as used for contacting semiconductor components, and to a device which can be used for this purpose. The aim of the invention is to improve navigation on the structural unit 1. Regarding the structural unit 1 provided on a holding surface 19 of a holding device 18, a graphical representation 4 of the structural unit 1 or its semiconductor component 2, or of a section thereof, is provided, and a live image 3 of the semiconductor component 2 is displayed on a first display unit 33. A first graphical representation 4 is also displayed on the first display unit 33 in such a way that elements of the first graphical representation 4, referred to as overlays 5, superimpose the live image 3. The first graphical representation 4 is synchronized with the live image 3 in a computer-aided manner such that at least one overlay 5 corresponds to the associated element of the live image 3.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.

Abstract: A prober for testing devices in a repeat structure on a substrate is provided with a probe holder plate, probe holders mounted on the plate, and a test probe associated with each holder. Each test probe is displaceable via a manipulator connected to a probe holder, and a substrate carrier fixedly supports the substrate. Testing of devices, which are situated in a repeat structure on a substrate, in sequence without a substrate movement and avoiding individual manipulation of the test probes in relation to the contact islands on the devices, is achieved in that the probe holders are fastened on a shared probe holder plate and the probe holder plate is moved in relation to the test substrate.