Patents by Inventor Sebastian Giessmann
Sebastian Giessmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250147067Abstract: A probe system for double side probing includes a chuck having a through hole for a substrate including a DUT to be disposed on the chuck and defined with an edge part supported by the chuck and a central part located correspondingly to the through hole, upper and lower probe devices, including electrical and optical probe devices, disposed above and below the through hole respectively for testing the DUT on top and bottom sides of the substrate, and a support device disposed on the side of the chuck opposite to the electrical probe device. When an electrical probe of the electrical probe device contacts the top or bottom side of the substrate, a supporter of the support device contacts the other side and is located adjacent to the electrical probe with the substrate located therebetween to resist the force from the electrical probe to avoid substrate deformation.Type: ApplicationFiled: November 6, 2024Publication date: May 8, 2025Applicant: MPI CORPORATIONInventors: PO-YI TING, YU-HSUN HSU, TING-AN YEN, SEBASTIAN GIESSMANN
-
Publication number: 20250102539Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.Type: ApplicationFiled: December 9, 2024Publication date: March 27, 2025Inventors: STOJAN KANEV, MEI-TING LU, SEBASTIAN GIESSMANN
-
Patent number: 12196779Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.Type: GrantFiled: August 16, 2022Date of Patent: January 14, 2025Assignee: MPI CORPORATIONInventors: Stojan Kanev, Mei-Ting Lu, Sebastian Giessmann
-
Patent number: 12196808Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.Type: GrantFiled: March 14, 2023Date of Patent: January 14, 2025Assignee: MPI CORPORATIONInventors: Sebastian Giessmann, Yu-Hsun Hsu
-
Patent number: 12092658Abstract: An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.Type: GrantFiled: July 24, 2022Date of Patent: September 17, 2024Assignee: MPI CORPORATIONInventors: Sebastian Giessmann, Po-Yi Ting
-
Patent number: 12007319Abstract: An optical path correction subassembly, an optical detection assembly, and an optical detection system are provided. The optical path correction subassembly can be optionally configured to be applied to a light detector. The optical path correction subassembly includes a holder structure and an optical path correction structure carried by the holder structure, and the optical path correction structure has a light beam guiding surface arranged as a reverse inclination inclined relative to a vertical line. The light beam guiding surface of the optical path correction structure can be configured to effectively or accurately guide a predetermined light beam to a light receiving surface of the light detector so as to facilitate collection of the predetermined light beam. The light beam guiding surface of the optical path correction structure can be arranged at an acute angle relative to the light receiving surface of the light detector.Type: GrantFiled: November 2, 2022Date of Patent: June 11, 2024Assignee: MPI CORPORATIONInventors: Po-Yi Ting, Ting-An Yen, Yu-Hsun Hsu, Sebastian Giessmann
-
Publication number: 20230314505Abstract: A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.Type: ApplicationFiled: March 14, 2023Publication date: October 5, 2023Applicant: MPI CorporationInventors: Sebastian Giessmann, Yu-Hsun Hsu
-
Patent number: 11754511Abstract: The invention relates to a method for optically representing electronic semiconductor components 2 on structural units 1 as used for contacting semiconductor components, and to a device which can be used for this purpose. The aim of the invention is to improve navigation on the structural unit 1. Regarding the structural unit 1 provided on a holding surface 19 of a holding device 18, a graphical representation 4 of the structural unit 1 or its semiconductor component 2, or of a section thereof, is provided, and a live image 3 of the semiconductor component 2 is displayed on a first display unit 33. A first graphical representation 4 is also displayed on the first display unit 33 in such a way that elements of the first graphical representation 4, referred to as overlays 5, superimpose the live image 3. The first graphical representation 4 is synchronized with the live image 3 in a computer-aided manner such that at least one overlay 5 corresponds to the associated element of the live image 3.Type: GrantFiled: November 19, 2018Date of Patent: September 12, 2023Assignee: FormFactor, Inc.Inventors: Jens Fiedler, Sebastian Gießmann
-
Patent number: 11703541Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.Type: GrantFiled: November 12, 2021Date of Patent: July 18, 2023Inventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
-
Patent number: 11693050Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.Type: GrantFiled: November 12, 2021Date of Patent: July 4, 2023Inventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
-
Publication number: 20230147804Abstract: An optical path correction subassembly, an optical detection assembly, and an optical detection system are provided. The optical path correction subassembly can be optionally configured to be applied to a light detector. The optical path correction subassembly includes a holder structure and an optical path correction structure carried by the holder structure, and the optical path correction structure has a light beam guiding surface arranged as a reverse inclination inclined relative to a vertical line. The light beam guiding surface of the optical path correction structure can be configured to effectively or accurately guide a predetermined light beam to a light receiving surface of the light detector so as to facilitate collection of the predetermined light beam. The light beam guiding surface of the optical path correction structure can be arranged at an acute angle relative to the light receiving surface of the light detector.Type: ApplicationFiled: November 2, 2022Publication date: May 11, 2023Inventors: PO-YI TING, TING-AN YEN, YU-HSUN HSU, SEBASTIAN GIESSMANN
-
Publication number: 20230058964Abstract: An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.Type: ApplicationFiled: July 24, 2022Publication date: February 23, 2023Inventors: SEBASTIAN GIESSMANN, PO-YI TING
-
Publication number: 20230059740Abstract: A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.Type: ApplicationFiled: August 16, 2022Publication date: February 23, 2023Inventors: STOJAN KANEV, MEI-TING LU, SEBASTIAN GIESSMANN
-
Publication number: 20220155365Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.Type: ApplicationFiled: November 12, 2021Publication date: May 19, 2022Applicant: MPI CorporationInventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
-
Publication number: 20220155366Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.Type: ApplicationFiled: November 12, 2021Publication date: May 19, 2022Applicant: MPI CorporationInventors: Volker Hansel, Sebastian Giessmann, Frank Fehrmann, Chien-Hung Chen
-
Patent number: 11313883Abstract: A probe station includes a base, a adaptor, a probe holder and a probe. The adaptor has a first portion and a second portion away from the first portion towards a first direction by a first length. The first portion connects to the base. A probe holder connects to the second portion and extends towards a second direction opposite to the first direction by a second length. The probe connects to an end of the probe holder away from the second portion and extends towards the second direction by a third length. A product of a thermal coefficient of the adaptor and the first length is equal to a sum of a product of a thermal coefficient of the probe holder and the second length and a product of a thermal coefficient of the probe and the third length.Type: GrantFiled: September 10, 2020Date of Patent: April 26, 2022Assignee: MPI CORPORATIONInventors: Yu-Hsun Hsu, Jhih-Wei Fang, Sebastian Giessmann
-
Publication number: 20220074972Abstract: A probe station includes a base, a adaptor, a probe holder and a probe. The adaptor has a first portion and a second portion away from the first portion towards a first direction by a first length. The first portion connects to the base. A probe holder connects to the second portion and extends towards a second direction opposite to the first direction by a second length. The probe connects to an end of the probe holder away from the second portion and extends towards the second direction by a third length. A product of a thermal coefficient of the adaptor and the first length is equal to a sum of a product of a thermal coefficient of the probe holder and the second length and a product of a thermal coefficient of the probe and the third length.Type: ApplicationFiled: September 10, 2020Publication date: March 10, 2022Inventors: Yu-Hsun HSU, Jhih-Wei FANG, Sebastian GIESSMANN
-
Patent number: 10996239Abstract: A method of positioning probe tips relative to pads includes: focusing on each of the probe tips in a first image as viewed by a microscope and collecting the coordinates of the corresponding probe tip relative to a first reference point in the first image; focusing on each of the pads in a second image as viewed by the microscope and collecting the coordinates of the corresponding pad relative to a second reference point in the second image, a relative position of the second reference point to the first reference point being predetermined; matching the pads with the probe tips when the quantity of the probe tips and the pads are equal while minimizing a maximum value of the distances calculated between each of the probe tips and the corresponding pad; and moving the probe tips to touch the pads with the maximum value minimized.Type: GrantFiled: May 12, 2020Date of Patent: May 4, 2021Assignee: MPI CORPORATIONInventors: Ingo Berg, Chien-Hung Chen, Frank Fehrmann, Sebastian Giessmann
-
Patent number: 10895587Abstract: A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.Type: GrantFiled: December 26, 2018Date of Patent: January 19, 2021Assignee: MPI CorporationInventors: Yu-Hsun Hsu, Jhih-Wei Fang, Stojan Kanev, Sebastian Giessmann
-
Publication number: 20200209279Abstract: A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.Type: ApplicationFiled: December 26, 2018Publication date: July 2, 2020Inventors: Yu-Hsun HSU, Jhih-Wei FANG, Stojan KANEV, Sebastian GIESSMANN