Patents by Inventor Sebastian Goris

Sebastian Goris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250001706
    Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface.
    Type: Application
    Filed: September 11, 2024
    Publication date: January 2, 2025
    Inventors: Jens Eichler, Peter J. Schneider, Sebastian Goris, Jay B. Preston, Eric L. Askeland, Steven D. Solomonson, Sung W. Moon, Michael P. Wald
  • Patent number: 12115737
    Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: October 15, 2024
    Assignee: 3M Innovative Properties Company
    Inventors: Jacob P. Podkaminer, Jens Eichler, Peter J. Schneider, Sebastian Goris, Victor Ho, Joseph A. Dunbar, Matthew T. Johnson, Matthew H. Frey
  • Publication number: 20230357973
    Abstract: Netting (100) comprising an array of polymeric strands (101, 102), wherein the polymeric strands (101, 102) are periodically joined together at bond regions (105) throughout the array with spaces (103, 109) between adjacent strands, wherein at least a plurality (i.e., at least two) of the strands are hollow polymeric strands (i.e., a hollow core (106) with a sheath (107) surrounding the hollow core), and wherein at least 50 percent by number of the strands do not substantially cross over each other. In some embodiments, the core comprises fluid. Embodiments of nettings described herein are useful for example, for thermal transport in thermal interface articles used to control the temperature of and/or dissipate heat for electronic components and batteries or mechanical devices.
    Type: Application
    Filed: February 18, 2020
    Publication date: November 9, 2023
    Inventors: Ronald W. Ausen, William J. Kopecky, Sebastian Goris
  • Publication number: 20230339194
    Abstract: The present disclosure provides a thermally conductive article including a pad having first and second opposed major surfaces and a thickness therebetween. The thickness is formed of entangled thermally conductive fibers and at least a portion of the entangled thermally conductive fibers have at least one terminal end at the first opposed major surface, the opposed second major surface, or both. The pad is at least partially impregnated with a polymer. Another thermally conductive article is provided including a) a pad having first and second opposed major surfaces and a thickness therebetween; b) a first thermally conductive skin layer; and c) a second thermally conductive skin layer. The thickness of the pad is formed of aligned thermally conductive fibers, and at least a portion of the thermally conductive fibers have a terminal end at the first opposed major surface and the opposed second major surface.
    Type: Application
    Filed: February 18, 2021
    Publication date: October 26, 2023
    Inventors: Jacob P. Podkaminer, Jens Eichler, Peter J. Schneider, Sebastian Goris, Victor Ho, Joseph A. Dunbar, Matthew T. Johnson, Jay B. Preston, Matthew H. Frey, Eric L. Askeland, Steven D. Solomonson, Sung W. Moon, Michael P. Wald
  • Patent number: 11731408
    Abstract: A multilayer film comprises first, second, and third layers. The first layer comprises at least one aromatic polyester, and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is thermoplastic and has a loss modulus at 1 hertz and 25° C. of less than or equal to 60 megapascals and comprises a thermoplastic elastomer and a polyamide. The third layer contacts the second layer opposite the first layer and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is sandwiched between the first and third layers. A method of making the multilayer film by coextrusion is also disclosed.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: August 22, 2023
    Assignee: 3M Innovative Properties Company
    Inventors: Mario A. Perez, Mary E. Johansen, Sebastian Goris, Lesbia E. Giron, Rajdeep S. Kalgutkar, Ta-Hua Yu, Paul T. Hines, Stephen A. Johnson
  • Publication number: 20230055151
    Abstract: A thermal interface layer includes pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent. The first and second particles have different compositions. The first particles include one or more of iron or nickel. The second particles include one or more of aluminum, magnesium, silicon, copper, or zinc. The thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1?0.17 V+0.002 V2.
    Type: Application
    Filed: January 14, 2021
    Publication date: February 23, 2023
    Inventors: Samuel J. Carpenter, Aaron K. Nienaber, Joseph B. Eckel, Ronald D. Jesme, Jacob P. Podkaminer, Victor Ho, Sebastian Goris, Matthew T. Johnson, Michael S. Graff, Steven H. Kong
  • Publication number: 20220347982
    Abstract: A multilayer film comprises first, second, and third layers. The first layer comprises at least one aromatic polyester, and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is thermoplastic and has a loss modulus at 1 hertz and 25° C. of less than or equal to 60 megapascals and comprises a thermoplastic elastomer and a polyamide. The third layer contacts the second layer opposite the first layer and has a loss modulus at 1 hertz and 25° C. of at least 70 megapascals. The second layer is sandwiched between the first and third layers. A method of making the multilayer film by coextrusion is also disclosed.
    Type: Application
    Filed: September 18, 2020
    Publication date: November 3, 2022
    Inventors: Mario A. Perez, Mary E. Johansen, Sebastian Goris, Lesbia E. Giron, Rajdeep S. Kalgutkar, Ta-Hua Yu, Paul T. Hines, Stephen A. Johnson
  • Publication number: 20220259465
    Abstract: A core-sheath filament having a) a core that is a thermally conductive pressure-sensitive adhesive particles and b) a non-tacky, thermoplastic sheath is provided. The thermally conductive pressure-sensitive adhesive in the core includes a (meth)acrylate-based polymeric material and thermally conductive particles. Additionally, methods of making the core-sheath filament and methods of using the core-sheath filament to print a thermally conductive pressure-sensitive adhesive are described.
    Type: Application
    Filed: August 6, 2020
    Publication date: August 18, 2022
    Inventors: Alexander J. Kugel, Mario A. Perez, Sebastian Goris, Matthew H. Frey, Ross E. Behling, Mark E. Napierala, Thomas Q. Chastek, Jacob D. Young, Shaun M. West, Tomoaki Uchiya
  • Publication number: 20220259398
    Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles and a multiplicity of magnetic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles, magnetic particles and optional magnetic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing thermal interface materials that also provide magnetic properties useful, for example, in flux field directional materials or shielding from electromagnetic interference.
    Type: Application
    Filed: May 9, 2020
    Publication date: August 18, 2022
    Inventors: Sebastian Goris, Derek J. Dehn, Paul T. Hines, Michael S. Graff, JR., Mario A. Perez, Charles L. Bruzzone, Bharat R. Acharya, Clinton P. Waller
  • Publication number: 20220213372
    Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles, and a multiplicity of endothermic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles and endothermic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 10% of its initial volume when exposed to a temperature of at least 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, as fillers, thermal interface materials, and thermal management materials, for example, in electronic devices, more particularly mobile handheld electronic devices, power supplies, and batteries.
    Type: Application
    Filed: May 6, 2020
    Publication date: July 7, 2022
    Inventors: Paul T. Hines, Derek J. Dehn, Sebastian Goris, Clinton P. Waller, Jr., Mario A. Perez, Bharat R. Acharya, Ronald W. Ausen
  • Publication number: 20220213288
    Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a multiplicity of thermally-conductive particles, a multiplicity of intumescent particles and optionally a multiplicity of endothermic particles distributed within the (co)polymeric network structure; wherein the thermally-conductive particles, intumescent particles and optional endothermic particles are present in a range from 15 to 99 weight percent, based on the total weight of the particles and the (co)polymer (excluding the solvent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 50% over its initial volume when exposed to at least one temperature greater than 135° C. when exposed to at least one temperature greater than 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, thermally-initiated fuses, and fire-stop devices.
    Type: Application
    Filed: May 7, 2020
    Publication date: July 7, 2022
    Inventors: Derek J. Dehn, Sebastian Goris, Paul T. Hines, Clinton P. Waller, Jr., Mario A. Perez, Bharat R. Acharya, Brandon A. Bartling
  • Publication number: 20220186030
    Abstract: (Co)polymer matrix composites including a porous (co)polymeric network; a nonvolatile diluent, and a multiplicity of thermally-conductive particles distributed within the (co)polymeric network; wherein the thermally-conductive particles are present in a range from 15 to 99 weight percent, based on the total weight of the (co)polymer matrix (including the thermally-conductive particles and the nonvolatile diluent). Optionally, the (co)polymer matrix composite volumetrically expands by at least 10% of its initial volume when exposed to a temperature of at least 135° C. Methods of making and using the (co)polymer matrix composites are also disclosed. The (co)polymer matrix composites are useful, for example, as heat dissipating or heat absorbing articles, as fillers, thermal interface materials, and thermal management materials, for example, in electronic devices, more particularly mobile handheld electronic devices, power supplies, and batteries.
    Type: Application
    Filed: May 7, 2020
    Publication date: June 16, 2022
    Inventors: Sebastian Goris, Derek J. Dehn, Paul T. Hines, Clinton P. Waller, Jr., Mario A. Perez, Bharat R. Acharya, Ronald W. Ausen