Abstract: A vacuum orientation module for a substrate processing system is described. The module includes at least a first vacuum orientation chamber, comprising: a vacuum chamber; a first transportation track within the vacuum chamber, the first transportation track having a first support structure and a first driving structure and defining a transportation direction; an orientation actuator to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has a first pair of two slit openings, particularly essentially vertical slit openings, at opposing side walls of the vacuum chamber in the transportation direction; and a second transportation track within the vacuum chamber, the second transportation track having a second support structure and a second driving structure extending along the transportation direction, the vacuum chamber has a second pair of two slit openings at the opposing side walls of the vacuum chamber.

Abstract: A vacuum orientation module for a substrate processing system is described. The module includes at least a first vacuum orientation chamber, comprising: a vacuum chamber; a transportation track within the vacuum chamber, the transportation track having a support structure and a driving structure and defining a transportation direction; and an orientation actuator to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has two slit openings, particularly two essentially vertically slit openings, at opposing side walls of the vacuum chamber in the transportation direction.

Abstract: A substrate processing system for processing of a plurality of substrates is described. The system includes a first deposition module being a first in-line module and having a first plurality of vacuum deposition sources; a second deposition module being a second in-line module and having a second plurality of vacuum deposition sources; and a glass handling module between the first deposition module and the second deposition module.

Abstract: A vacuum orientation module for a substrate processing system is described. The module includes at least a first vacuum orientation chamber, comprising: a vacuum chamber; a first transportation track within the vacuum chamber, the first transportation track having a first support structure and a first driving structure and defining a transportation direction; an orientation actuator to change the substrate orientation between a non-vertical orientation and a non-horizontal orientation, the vacuum chamber has a first pair of two slit openings, particularly essentially vertical slit openings, at opposing side walls of the vacuum chamber in the transportation direction; and a second transportation track within the vacuum chamber, the second transportation track having a second support structure and a second driving structure extending along the transportation direction, the vacuum chamber has a second pair of two slit openings at the opposing side walls of the vacuum chamber.

Abstract: The present disclosure provides an apparatus for vacuum processing of a substrate. The apparatus includes a processing vacuum chamber, a maintenance vacuum chamber, an opening for transferring at least a portion of a material deposition source between the processing vacuum chamber and the maintenance vacuum chamber, and a magnetic closing arrangement for magnetically closing the opening.

Abstract: A method of operating a vacuum processing system with a main transportation path along which substrates can be transported in a main transportation direction is described. The method includes routing a substrate out of the main transportation path into a first deposition module for depositing a first material on the substrate; routing the substrate out of the main transportation path into a second deposition module for depositing a second material on the substrate; and routing the substrate out of the main transportation path into one or more further deposition modules for depositing one or more further materials on the substrate. Further, various methods of operating one or more rotation modules of vacuum processing system configured for depositing two or more materials on a plurality of substrates are described.

Abstract: The present disclosure provides a deposition apparatus for a vacuum deposition process. The deposition apparatus includes a vacuum chamber, a movable deposition source arranged in the vacuum chamber, and a supply arrangement providing a supply passage for media supply lines for the movable deposition source, wherein the supply arrangement comprises an axially deflectable element.

Abstract: A method of handling a mask device configured for masked deposition on a substrate is described. The method includes: loading a mask device into a vacuum system; attaching the mask device to a mask carrier in the vacuum system; and transporting the mask carrier that holds the mask device in a non-horizontal orientation along a transport path in the vacuum system. A further mask handling method includes: transporting a mask carrier that holds a mask device in a non-horizontal orientation along a transport path in a vacuum system; detaching the mask device from the mask carrier in the vacuum system; and unloading the mask device from the vacuum system. According to a further aspect, a mask handling assembly for handling a mask device as well as a vacuum system with at least one mask handling assembly are described.

Abstract: The present disclosure provides an apparatus (200) for vacuum processing of a substrate (10). The apparatus (200) includes a vacuum chamber, a first track arrangement (110) configured for transportation of a substrate carrier (120), a second track arrangement (130) configured for transportation of a mask carrier (140), and a holding arrangement configured for positioning the substrate carrier (120) and the mask carrier (140) with respect to each other. The first track arrangement (110) includes a first portion configured to support the substrate carrier (120) at a first end (12) of the substrate (10) and a second portion configured to support the substrate carrier (120) at a second end (14) of the substrate (10) opposite the first end (12) of the substrate (10).

Abstract: A carrier for use in a vacuum system is described. The carrier includes: a magnet arrangement including one or more first permanent magnets; one or more second permanent magnets; and a magnet device configured to change a magnetization of the one or more first permanent magnets. The carrier may be used for carrying a mask device or a substrate in the vacuum system. Further, a vacuum system and a method of operating a vacuum system are described.

Abstract: The present disclosure provides an apparatus (100) for vacuum processing of a substrate (10). The apparatus (100) includes a first vacuum region (110), a second vacuum region (120), an opening (130) between the first vacuum region (100) and the second vacuum region (130), and a closing arrangement (140) for closing the opening (130). The closing arrangement includes one or more first permanent magnets, one or more second permanent magnets, and a magnet device configured to change a magnetization of the one or more first permanent magnets.

Abstract: An apparatus for routing a carrier in a processing system is described. The apparatus includes a first holding assembly attached to a vacuum chamber for transportation of the carrier along a first direction, a second holding assembly attached to the vacuum chamber for transportation of the carrier along a second direction different from the first direction, and a rotatable support for rotating the carrier from the first direction to the second direction.