Patents by Inventor Sebastian Holl
Sebastian Holl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11873614Abstract: A frame system for a manhole covering includes at least one first frame element and one second frame element, each including at least one first connecting surface and/or at least one second connecting surface. The first and second frame elements are connectable to one another in a friction-locked and/or formfitting manner along the opposing first or second connecting surfaces, wherein in the connected state of the first and second frame element at least one joining region is formed between the opposing first connecting surfaces or between the opposing second connecting surfaces. The joining region can be filled using a joining element in such a way that the joined connection of the frame elements is detachable and reproducible wherein the joining element comprises a hot melt adhesive.Type: GrantFiled: August 21, 2019Date of Patent: January 16, 2024Assignee: ACO AHLMANN SE & CO. KGInventor: Sebastian Holl
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Patent number: 11774688Abstract: A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.Type: GrantFiled: January 29, 2021Date of Patent: October 3, 2023Assignee: SICOYA GMBHInventors: Stefan Meister, Moritz Grehn, Sven Otte, Sebastian Höll
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Publication number: 20220244473Abstract: A photonic component having a photonically integrated chip and a fibre mounting, wherein the fibre mounting has: at least one groove, into which an optical fibre is placed, and at least one mirror surface, which reflects radiation from the fibre in the direction of the photonically integrated chip and/or reflects radiation from the photonically integrated chip in the direction of the fibre. A chip stack comprising at least two chips is arranged between the photonically integrated chip and the fibre mounting, the chip stack has at least two through holes and in each case a guide pin, which positions the chip stack and the fibre mounting relative to one another, passes through the at least two through holes of the chip stack.Type: ApplicationFiled: January 29, 2021Publication date: August 4, 2022Applicant: Sicoya GmbHInventors: Stefan MEISTER, Moritz GREHN, Sven OTTE, Sebastian HÖLL
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Publication number: 20210198862Abstract: The invention relates to a frame system (1) for a manhole covering (100) having at least one first frame element (10) and one second frame element (20), which each include at least one first connecting surface (10a; 20a) and/or at least one second connecting surface (10b; 20b). The first and second frame element (10; 20) are connectable to one another in a friction-locked and/or formfitting manner along the opposing first or second connecting surfaces (10a; 10b; 20a; 20b), wherein in the connected state of the first and second frame element (10; 20) at least one joining region (12) is formed between the opposing first connecting surfaces (10a; 20a) or between the opposing second connecting surfaces (10b; 20b). The joining region (12) can be filled using a joining element (60) in such a way that the joined connection of the frame elements (10; 20) is detachable and reproducible wherein the joining element (90) comprises a hot melt adhesive.Type: ApplicationFiled: August 21, 2019Publication date: July 1, 2021Inventor: Sebastian Holl
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Patent number: 11002924Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.Type: GrantFiled: December 11, 2018Date of Patent: May 11, 2021Assignee: SICOYA GMBHInventors: Moritz Grehn, Marco Vitali, Sebastian Höll, Andreas Hakansson
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Patent number: 10948666Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).Type: GrantFiled: May 2, 2018Date of Patent: March 16, 2021Assignee: SICOYA GMBHInventors: Stefan Meister, Moritz Grehn, Sven Otte, Sebastian Höll
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Publication number: 20200183099Abstract: An exemplary embodiment of the invention relates to an optical connector comprising a wave-guiding element and a lens device configured to transmit radiation between the wave-guiding element and at least one optical port of the connector, wherein the lens device comprises a first outer surface and a second outer surface opposite the first outer surface, wherein the first outer surface is connected to the wave-guiding element and forms at least one lens, and wherein a section of the second outer surface opposite said at least one lens forms said at least one optical port of the connector.Type: ApplicationFiled: December 11, 2018Publication date: June 11, 2020Applicant: Sicoya GmbHInventors: Moritz GREHN, Marco VITALI, Sebastian HÖLL, Andreas HAKANSSON
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Publication number: 20200096713Abstract: The invention relates to a photonic component (10) having a photonically integrated chip (1) and a fibre mounting (5), wherein the fibre mounting (5) has: at least one groove (52), into which an optical fibre (30) is placed, and at least one mirror surface (52), which reflects radiation (S) from the fibre (30) in the direction of the photonically integrated chip (1). According to the invention a chip stack (20) comprising at least two chips is arranged between the photonically integrated chip (1) and the fibre mounting (5), the chip stack (20) has at least two through holes (21) and in each case a guide pin (40), which positions the chip stack (20) and the fibre mounting (5) relative to one another, passes through the at least two through holes (21) of the chip stack (20).Type: ApplicationFiled: May 2, 2018Publication date: March 26, 2020Applicant: Sicoya GmbHInventors: Stefan MEISTER, Moritz GREHN, Sven OTTE, Sebastian HÖLL
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Patent number: 10481350Abstract: An embodiment of the invention relates to an optical assembly comprising a circuit board comprising a first side, a second side, and at least one hole that extends through the circuit board, a photonic chip having a front side and a back side, the front side of the photonic chip being mounted on the first side of the circuit board and electrically connected to at least one electrical conductor of the circuit board, at least one component being mounted on the front side of the photonic chip opposite the hole and protruding from the front side of the photonic chip into the hole or through the hole, and a wave-guiding element that is located on the second side of the circuit board and optically coupled to the photonic chip through said hole.Type: GrantFiled: December 11, 2018Date of Patent: November 19, 2019Assignee: Sicoya GmbHInventors: Moritz Grehn, Marco Vitali, Sebastian Höll, Andreas Hakansson, Chenhui Jiang