Patents by Inventor Sebastian IVENZ

Sebastian IVENZ has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Clamping force measuring instruments and modules thereof
    Patent number: 11215517
    Abstract: A clamping force measuring instrument for a radial clamping device having at least one force sensor for detecting a clamping force of the clamping device and an evaluation device for evaluating sensor data of the force sensor. The clamping force measuring instrument is embodied as a modular clamping force measuring instrument, having an evaluation module a sensor module. The sensor module includes at least one measurement surface and the force sensor. The evaluation module has a radio interface, a memory and/or a display device. The sensor module and the evaluation module are configured for coupling to one another by a coupling device and each has a data connection device. The data connection devices are connected to one another to produce a data connection in the event of the sensor module being coupled to the evaluation module.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: January 4, 2022
    Assignee: HAINBUCH GMBH SPANNENDE TECHNIK
    Inventors: Sebastian Ivenz, Andreas Keller
  • CLAMPING FORCE MEASURING INSTRUMENTS AND MODULES THEREOF
    Publication number: 20200003642
    Abstract: A clamping force measuring instrument for a radial clamping device having at least one force sensor for detecting a clamping force of the clamping device and an evaluation device for evaluating sensor data of the force sensor. The clamping force measuring instrument is embodied as a modular clamping force measuring instrument, having an evaluation module a sensor module. The sensor module includes at least one measurement surface and the force sensor. The evaluation module has a radio interface, a memory and/or a display device. The sensor module and the evaluation module are configured for coupling to one another by a coupling device and each has a data connection device. The data connection devices are connected to one another to produce a data connection in the event of the sensor module being coupled to the evaluation module.
    Type: Application
    Filed: February 14, 2018
    Publication date: January 2, 2020
    Inventors: Sebastian IVENZ, Andreas KELLER