Patents by Inventor Sebastian Kisban

Sebastian Kisban has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11317819
    Abstract: The present invention refers to a blood pressure measuring system (10) configured to surround a patient's body part (E), comprising pressurization means (12, 14) for applying pressure to the body part (E), and comprising a kinking-proof shell (20; 30), wherein the kinking-proof shell (20; 30) is arranged so as to be located between the pressurization means (12, 14) and the body part (E), when the blood pressure measuring system (10) surrounds the body part (E). The present invention further refers to a method of applying a blood pressure measuring system (10).
    Type: Grant
    Filed: February 7, 2014
    Date of Patent: May 3, 2022
    Assignee: Philips Medizin Systeme Böblingen GmbH
    Inventors: Ulrich Pfeiffer, Sebastian Kisban, Tobias Thomamüller, Anna-Luisa Uhlitz, Reinhold Knoll
  • Patent number: 11181408
    Abstract: A thermoresistive gas sensor, e.g. for a flow sensor or a thermal conductivity detector, has a lattice with lattice webs, which consist of a semiconductor material arranged in the plane of the lattice in parallel next to one another, wherein the semiconductor material is formed on a plate-shaped semiconductor substrate that extends over a window-like cutout in the semiconductor substrate and forms the lattice, where the semiconductor layer is doped outside the cutout in areas of two ends of the lattice at least over the width of the lattice until it degenerates and/or bears metallizations, where the semiconductor layer further contains a separation structure insulating the two ends of the lattice from one another, in which the semiconductor material is removed or is not doped, and where the lattice webs extend in an S shape and are connected electrically in parallel to achieve a high measurement sensitivity and mechanical stability.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: November 23, 2021
    Assignee: Siemens Aktiengesellschaft
    Inventors: Sebastian Kisban, Stefan Klehr, Thomas Neuhauser, Piotr Strauch, Jörg Zapf, Jürgen Zettner, Stefan Von Dosky
  • Publication number: 20190301908
    Abstract: A thermoresistive gas sensor, e.g. for a flow sensor or a thermal conductivity detector, has a lattice with lattice webs, which consist of a semiconductor material arranged in the plane of the lattice in parallel next to one another, wherein the semiconductor material is formed on a plate-shaped semiconductor substrate that extends over a window-like cutout in the semiconductor substrate and forms the lattice, where the semiconductor layer is doped outside the cutout in areas of two ends of the lattice at least over the width of the lattice until it degenerates and/or bears metallizations, where the semiconductor layer further contains a separation structure insulating the two ends of the lattice from one another, in which the semiconductor material is removed or is not doped, and where the lattice webs extend in an S shape and are connected electrically in parallel to achieve a high measurement sensitivity and mechanical stability.
    Type: Application
    Filed: March 28, 2019
    Publication date: October 3, 2019
    Inventors: Sebastian Kisban, Stefan KLEHR, Thomas NEUHAUSER, Piotr STRAUCH, Jörg ZAPF, Jürgen ZETTNER, Stefan VON DOSKY
  • Publication number: 20150359446
    Abstract: The present invention refers to a blood pressure measuring system (10) configured to surround a patient's body part (E), comprising pressurization means (12, 14) for applying pressure to the body part (E), and comprising a kinking-proof shell (20; 30), wherein the kinking-proof shell (20; 30) is arranged so as to be located between the pressurization means (12, 14) and the body part (E), when the blood pressure measuring system (10) surrounds the body part (E). The present invention further refers to a method of applying a blood pressure measuring system (10).
    Type: Application
    Filed: February 7, 2014
    Publication date: December 17, 2015
    Inventors: Ulrich Pfeiffer, Sebastian Kisban, Tobias Thomamüller, Anna-Luisa Uhlitz, Reinhold Knoll
  • Publication number: 20110048799
    Abstract: In a process for assembling a microstructure (1), provision is made of a first microstructure piece (2) having a receiving recess (3) in its surface and a second microstructure piece (5) having a connecting region (6) fitting into the receiving recess (3) and on which is arranged at least one electrical contact element (7a, 7b). Provision is made of a flexible cable (8) having a flat substrate layer (9) made of an electrically insulating material and at least one strip conductor (10) arranged thereon. The cable (8) has at least one tongue (14a, 14b) on which is arranged at least one counter-contact element (11a, 11b) connected to the strip conductor (10). The cable (8) and the microstructure pieces (5) are positioned relative to each other in a preassembly position in which the connecting region (6) is opposite the receiving recess (3) and the tongue (14a, 14b) is aligned between the connecting region (6) and the receiving recess (3).
    Type: Application
    Filed: August 17, 2010
    Publication date: March 3, 2011
    Applicant: ALBERT-LUDWIGS-UNIVERSITAT FREIBURG
    Inventors: Sebastian Kisban, Stanislav Herwik, Patrick Ruther, Tobias Holzhammer, Oliver Paul
  • Publication number: 20100193234
    Abstract: A method for producing an electrical and mechanical connection, wherein a solid body comprises a support, on which is disposed an electrical contact zone and an electrically insulating support zone. A flexible, flat cable comprises a support layer made of an electrically insulating material and a strip conductor, with an electrical contacting point and a laterally adjacent insulating cable zone. An adhesive layer is applied on the cable and the contacting point is disposed on the support layer so that the adhesive layer surrounds the contacting point and adheres to the cable. The support and the cable are positioned in a pre-assembly position so that the contacting point of the cable is facing the contact zone of the support and the adhesive layer is facing the electrically insulating support zone. The solid body and the cable are positioned so that the contacting point electrically contacts the contact zone and the adhesive layer adheres to the surface of the solid body.
    Type: Application
    Filed: January 19, 2010
    Publication date: August 5, 2010
    Applicant: ALBERT-LUDWIGS-UNIVERSITAT FREIBURG
    Inventors: Sebastian Kisban, Ulrich Bartsch, Patrick Ruther, Johannes Kenntner, Oliver Paul