Patents by Inventor Sebastian KONIETZKO

Sebastian KONIETZKO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10903614
    Abstract: The invention relates to a method for sealing a contact point region comprising at least one contact point at an electrical line connection, wherein the line connection comprises at least one electrical line and at least one conductive element electrically connected thereto. The method starts by arranging a shrink tube on the outer circumference of the contact point region, in a first region extending over the contact point region on both sides in the longitudinal direction. This is followed by heating the shrink tube to shrinking temperature. During the heating of the shrink tube, an inductive heating of the electrical conductor is additionally performed, at least in the contact point region, and so hotmelt adhesive arranged inside the shrink tube and/or on the outer circumference of the contact point region is heated to its melting temperature. The invention also relates to a device for sealing a contact point region and to a sealing at such a region.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: January 26, 2021
    Assignee: PKC SEGU SYSTEMELEKTRIK GMBH
    Inventors: Michael Schneider, Sebastian Konietzko
  • Publication number: 20190221981
    Abstract: The invention relates to a method for sealing a contact point region comprising at least one contact point at an electrical line connection, wherein the line connection comprises at least one electrical line and at least one conductive element electrically connected thereto. The method starts by arranging a shrink tube on the outer circumference of the contact point region, in a first region extending over the contact point region on both sides in the longitudinal direction. This is followed by heating the shrink tube to shrinking temperature. During the heating of the shrink tube, an inductive heating of the electrical conductor is additionally performed, at least in the contact point region, and so hotmelt adhesive arranged inside the shrink tube and/or on the outer circumference of the contact point region is heated to its melting temperature. The invention also relates to a device for sealing a contact point region and to a sealing at such a region.
    Type: Application
    Filed: February 10, 2017
    Publication date: July 18, 2019
    Inventors: Michael SCHNEIDER, Sebastian KONIETZKO
  • Patent number: D1036249
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: July 23, 2024
    Assignee: BizLink Industry Germany GmbH
    Inventors: Torsten Denk, Sebastian Konietzko, Veit Wagner, Karina Weißensee, Christian Gießler