Patents by Inventor Sebastian Kotthoff

Sebastian Kotthoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEBONDABLE STRUCTURE BASED ON A SOLVENT-BORNE PRESSURE SENSITIVE ADHESIVE (PSA)
    Publication number: 20240067850
    Abstract: The present application is directed to a bonded structure comprising: a first substrate having an electrically conductive surface; and, a second substrate having an electrically conductive surface; wherein an electrochemically-debondable pressure sensitive adhesive film is disposed between the electrically conductive surfaces of the first and second substrates, said adhesive film being obtained by drying of a solvent-borne composition comprising, based on the weight of the composition: from 5 to 80 wt. % of a) at least one (meth)acrylate copolymer; from 0.1 to 30 wt. % of b) non-polymerizable electrolyte; and, from 10 to 90 wt. % of c) solvent.
    Type: Application
    Filed: October 13, 2023
    Publication date: February 29, 2024
    Inventors: Tobias Roschek, Carla Negele, Sebastian Kotthoff, Frank Goethel
  • Aqueous adhesive composition
    Patent number: 10400143
    Abstract: The present invention relates to aqueous adhesive dispersions based on (meth)acrylate which contain as the stabilizer a partially or completely hydrolyzed copolymer of at least one vinyl ester monomer, preferably vinyl acetate, and at least one alkene diester monomer, preferably, 3,4-diacetoxy-1-butene, and to the use of said compositions as labeling adhesives or sealing adhesives.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: September 3, 2019
    Assignee: Henkel AG & Co. KGaA
    Inventors: Oliver Sommer, Sebastian Kotthoff, Victor Dario Buj Vilalta, Ethel Abrahams-Meyer
  • AQUEOUS ADHESIVE COMPOSITION
    Publication number: 20160280973
    Abstract: The present invention relates to aqueous adhesive dispersions based on (meth)acrylate which contain as the stabilizer a partially or completely hydrolyzed copolymer of at least one vinyl ester monomer, preferably vinyl acetate, and at least one alkene diester monomer, preferably, 3,4-diacetoxy-1-butene, and to the use of said compositions as labeling adhesives or sealing adhesives.
    Type: Application
    Filed: June 8, 2016
    Publication date: September 29, 2016
    Inventors: Oliver SOMMER, Sebastian KOTTHOFF, Victor Dario BUJ VILALTA, Ethel ABRAHAMS-MEYER
  • Gum adhesive based on a filled polymer dispersion
    Patent number: 7488765
    Abstract: A filled gum adhesive useful for producing remoistenable layers contains fillers, protective colloids, and a (co)polymer, wherein the (co)polymer is prepared by polymerizing one or more ethylenically unsaturated monomers in the presence of a dispersion of protective colloid and filler particles.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: February 10, 2009
    Assignee: Henkel Kommanditgesellschaft Auf Aktien
    Inventors: Oliver Sommer, Horst Buxhofer, Nicolas De-Calmes, Ralf Gossen, Sebastian Kotthoff, Hans-Juergen Wolter, Ethel Abrahams-Meyer
  • Gum Adhesive Based on a Filled Polymer Dispersion
    Publication number: 20080058447
    Abstract: A filled gum adhesive useful for producing remoistenable layers contains fillers, protective colloids, and a (co)polymer, wherein the (co)polymer is prepared by polymerizing one or more ethylenically unsaturated monomers in the presence of a dispersion of protective colloid and filler particles.
    Type: Application
    Filed: September 6, 2007
    Publication date: March 6, 2008
    Inventors: Oliver Sommer, Horst Buxhofer, Nicolas De-Calmes, Ralf Gossen, Sebastian Kotthoff, Hans-Juergen Wolter, Ethel Abrahams-Meyer