Patents by Inventor Sebastian Michalski

Sebastian Michalski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module having a layer that includes inorganic filler and a casting material
    Patent number: 11848213
    Abstract: A power semiconductor module arrangement includes: a substrate arranged within a housing; at least one semiconductor body arranged on a top surface of the substrate; and a first layer arranged on a first surface within the housing. The first layer includes inorganic filler which is impermeable to corrosive gases and a casting material which fills spaces present in the inorganic filler.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: December 19, 2023
    Assignee: Infineon Technologies AG
    Inventors: Gopalakrishnan Trichy Rengarajan, Sebastian Michalski
  • Printed Circuit Board, Power Semiconductor Module Arrangement Comprising a Printed Circuit Board, and Method for Assembling the Same
    Publication number: 20230238314
    Abstract: A printed circuit board including a dielectric insulation layer having a top side facing a first side and a bottom side opposite the first side that faces a second side of the dielectric insulation layer, at least one conducting track formed on the dielectric insulation layer, and one or more conductor rails, wherein each of the one or more conductor rails is mechanically coupled to the dielectric insulation layer, and a first portion of each of the one or more conductor rails is arranged on the first side and a second portion of each of the one or more conductor rails is arranged on the second side of the dielectric insulation layer.
    Type: Application
    Filed: January 25, 2023
    Publication date: July 27, 2023
    Inventors: Sebastian Michalski, Guido Bönig
  • SEMICONDUCTOR MODULE HAVING A LAYER THAT INCLUDES INORGANIC FILLER AND A CASTING MATERIAL
    Publication number: 20210366730
    Abstract: A power semiconductor module arrangement includes: a substrate arranged within a housing; at least one semiconductor body arranged on a top surface of the substrate; and a first layer arranged on a first surface within the housing. The first layer includes inorganic filler which is impermeable to corrosive gases and a casting material which fills spaces present in the inorganic filler.
    Type: Application
    Filed: August 10, 2021
    Publication date: November 25, 2021
    Inventors: Gopalakrishnan Trichy Rengarajan, Sebastian Michalski
  • Semiconductor module and method for producing the same
    Patent number: 11121004
    Abstract: A method for producing a power semiconductor module arrangement includes forming a pre-layer by depositing inorganic filler on a first surface within a housing, the inorganic filler being impermeable to corrosive gases. The method further includes filling casting material into the housing to fill spaces present in the inorganic filler of the pre-layer with the casting material, and hardening the casting material to form a first layer.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: September 14, 2021
    Assignee: Infineon Technologies AG
    Inventors: Gopalakrishnan Trichy Rengarajan, Sebastian Michalski
  • Semiconductor Module and Method for Producing the Same
    Publication number: 20190221449
    Abstract: A method for producing a power semiconductor module arrangement includes forming a pre-layer by depositing inorganic filler on a first surface within a housing, the inorganic filler being impermeable to corrosive gases. The method further includes filling casting material into the housing to fill spaces present in the inorganic filler of the pre-layer with the casting material, and hardening the casting material to form a first layer.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Gopalakrishnan Trichy Rengarajan, Sebastian Michalski