Patents by Inventor Sebastian Michalski

Sebastian Michalski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210366730
    Abstract: A power semiconductor module arrangement includes: a substrate arranged within a housing; at least one semiconductor body arranged on a top surface of the substrate; and a first layer arranged on a first surface within the housing. The first layer includes inorganic filler which is impermeable to corrosive gases and a casting material which fills spaces present in the inorganic filler.
    Type: Application
    Filed: August 10, 2021
    Publication date: November 25, 2021
    Inventors: Gopalakrishnan Trichy Rengarajan, Sebastian Michalski
  • Patent number: 11121004
    Abstract: A method for producing a power semiconductor module arrangement includes forming a pre-layer by depositing inorganic filler on a first surface within a housing, the inorganic filler being impermeable to corrosive gases. The method further includes filling casting material into the housing to fill spaces present in the inorganic filler of the pre-layer with the casting material, and hardening the casting material to form a first layer.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: September 14, 2021
    Assignee: Infineon Technologies AG
    Inventors: Gopalakrishnan Trichy Rengarajan, Sebastian Michalski
  • Publication number: 20190221449
    Abstract: A method for producing a power semiconductor module arrangement includes forming a pre-layer by depositing inorganic filler on a first surface within a housing, the inorganic filler being impermeable to corrosive gases. The method further includes filling casting material into the housing to fill spaces present in the inorganic filler of the pre-layer with the casting material, and hardening the casting material to form a first layer.
    Type: Application
    Filed: January 15, 2019
    Publication date: July 18, 2019
    Inventors: Gopalakrishnan Trichy Rengarajan, Sebastian Michalski