Patents by Inventor Sebastian Molinari

Sebastian Molinari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110097874
    Abstract: The invention provides a method of trimming a structure that includes a first wafer bonded to a second wafer, with the first wafer having a chamfered edge. The method includes a first trimming step carried out over a first depth that includes at least the thickness of the first wafer and over a first width determined from the edge of the first wafer. A second trimming step is then carried out over a second depth that includes at least the thickness of the first wafer and over a second width that is less than the first width.
    Type: Application
    Filed: July 31, 2009
    Publication date: April 28, 2011
    Inventors: Marcel Broekaart, Marion Migette, Sebastian Molinari, Eric Neyret