Abstract: A method operates a multilevel converter for power factor correction of a polyphase mains voltage. Each phase of the polyphase main has an associated phase module with a plurality of sub modules which are connected in series and each have an electrical energy store. Each sub module can be connected to the phase of the mains voltage or disconnected there from by an electronic switch. A circuit breaker is provided for disconnecting the converter from the mains voltage. The converter has a regulation system by which the voltages of the phase modules are balanced when the circuit breaker is open.

Abstract: A locking system comprises a lock cylinder which has a cylinder housing, a cylinder core rotatably supported in the cylinder housing and having a keyway, and has a plurality of tumblers which partly project into the keyway, and which furthermore comprises a key which has a key bow and a key shaft which has a shaft profile for acting on the tumblers. An abutment section is formed at the key shaft between the key bow and the shaft profile, said abutment section having an abutment profile having at least one projection and an undercut formed between the projection and the shaft profile. The lock cylinder furthermore comprises a movable counter-abutment.

Abstract: In a method of producing an exhaust-gas heat exchanger of a motor vehicle, at least one component of the exhaust-gas heat exchanger, e.g. an outer jacket or ducts arranged in the outer jacket or metal sheets, is subjected to an electrochemical machining process to produce a homogenous and smooth surface. The electrochemical machining process may involve plasma-polishing or electro-polishing.

Abstract: In accordance with an embodiment of the invention, an integrated circuit including a plurality of connection pads is provided, wherein a first connection pad is configured in accordance with a first contacting technology, and wherein a second connection pad is configured in accordance with a second contacting technology. The second contacting technology is different from the first contacting technology.

Abstract: The invention relates to a method and arrangement for assembling and packaging single and multiple semiconductor dice with an intermediate arranged interposer. The interposer is arranged onto the backside of a die within the wafer composite and thereby during the wafer level process. Preferably the interposer is printed by a stencil printing process.