Patents by Inventor Sebastian Quek

Sebastian Quek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Zone polishing using variable slurry solid content
    Patent number: 6984166
    Abstract: A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
    Type: Grant
    Filed: August 1, 2003
    Date of Patent: January 10, 2006
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Alvaro Maury, Jovin Lim, Nace Layadi, Sebastian Quek
  • Zone polishing using variable slurry solid content
    Publication number: 20050026549
    Abstract: A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
    Type: Application
    Filed: August 1, 2003
    Publication date: February 3, 2005
    Inventors: Alvaro Maury, Jovin Lim, Nace Layadi, Sebastian Quek
  • Chemical mechanical polishing apparatus improved substrate carrier head and method of use
    Patent number: 6245193
    Abstract: An improved and new substrate carrier head for use in a CMP apparatus is described. The new substrate carrier head has a substrate retaining ring with embedded intersecting channels in the outer face. The embedded intersecting channels improve the circulation of polishing slurry to and from the polished substrate and polishing byproducts away from the polished substrate and thereby improve the polishing uniformity on the substrate.
    Type: Grant
    Filed: March 13, 2000
    Date of Patent: June 12, 2001
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: Ser Wee Sebastian Quek, Charles Lin, Jimmy Lo Yuk Ting
  • Chemical mechanical polishing apparatus with improved substrate carrier head and method of use
    Patent number: 6136710
    Abstract: An improved and new substrate carrier head for use in a CMP apparatus is described. The new substrate carrier head has a substrate retaining ring with embedded intersecting channels in the outer face. The embedded intersecting channels improve the circulation of polishing slurry to and from the polished substrate and polishing byproducts away from the polished substrate and thereby improve the polishing uniformity on the substrate.
    Type: Grant
    Filed: October 19, 1998
    Date of Patent: October 24, 2000
    Assignee: Chartered Semiconductor Manufacturing, Ltd.
    Inventors: Ser Wee Sebastian Quek, Charles Lin, Jimmy Lo(Yuk Ting)