Patents by Inventor Sebastian Redolfi

Sebastian Redolfi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12177986
    Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: December 24, 2024
    Assignee: TDK Electronics AG
    Inventors: Jan Ihle, Thomas Bernert, Stefan Endler, Michael Krenn, Stephan Bigl, Markus Puff, Sebastian Redolfi
  • Patent number: 12033774
    Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.
    Type: Grant
    Filed: July 3, 2020
    Date of Patent: July 9, 2024
    Assignee: TDK Electronics AG
    Inventors: Thomas Stendel, Jan Ihle, Christl Lisa Mead, Thomas Bernert, Sebastian Redolfi, Marko Vrabelj
  • Publication number: 20230354710
    Abstract: Piezoelectric assembly, which comprises a substrate of Ni, Cu, or steel, a first oriented layer assembled on the substrate and a piezoelectric layer on the oriented layer. The piezoelectric layer has a degree of (100) orientation with respect to the local surface normal of 90% or more.
    Type: Application
    Filed: June 2, 2021
    Publication date: November 2, 2023
    Inventors: Marko Vrabelj, Sebastian Redolfi
  • Publication number: 20220287187
    Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.
    Type: Application
    Filed: October 12, 2020
    Publication date: September 8, 2022
    Inventors: Jan Ihle, Thomas Bernert, Stefan Endler, Michael Krenn, Stephan Bigl, Markus Puff, Sebastian Redolfi
  • Publication number: 20220238260
    Abstract: An NTC thin film thermistor that includes at least a first thin film electrode, at least an NTC thin film, and at least a second thin film electrode. A further aspect relates to a method for producing an NTC thin film thermistor.
    Type: Application
    Filed: July 3, 2020
    Publication date: July 28, 2022
    Inventors: Thomas Stendel, Jan Ihle, Christl Lisa Mead, Thomas Bernert, Sebastian Redolfi, Marko Vrabelj