Patents by Inventor Sebastian Rohm

Sebastian Rohm has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip Scale Package Light Emitting Diode Module For Automotive Lighting Applications
    Publication number: 20190273072
    Abstract: LED modules for use in, for instance, automotive applications are provided. In one example implementation, the LED module can include a substrate. The LED module can include a plurality of chip-scale package LEDs. The plurality of chip-scale package LEDs can be arranged in a matrix on the substrate. Each chip-scale package LED can have a light emitting area that is about 80% or greater of a total area associated with the chip-scale package LED. Each chip-scale package LED can be separated from an adjacent chip-scale package LED by a gap. In some embodiments, a side coat material can be disposed in the gap.
    Type: Application
    Filed: February 6, 2019
    Publication date: September 5, 2019
    Inventors: Sebastian Rohm, Wolfgang Tusler, Martin Zippel