Abstract: A carrier head is provided that improves the pressure uniformity of a semiconductor wafer against the polishing pad in chemical mechanical polishing (CMP). The carrier head includes a carrier, a carrier film, and a guide ring. The objective of CMP is to provide planarization of the surface of a semiconductor wafer by uniformly removing material. One embodiment of the invention uses independent adjusting screws threaded in the carrier to provide uniform wafer pressure and lengthen guide ring life. The adjusting screws are threaded internally to accept holding screws attached to the guide ring using a backing. This facilitates variation in the spacing between the carrier and guide ring at each adjusting screw. A locking nut on each adjusting screw is used to maintain each gap setting. This embodiment eliminates the need for shims and the associated trial-and-error set-up time in selecting shims. In addition, compensating for guide ring wear can be easily performed without disassembling the carrier head.

Abstract: An apparatus for slurry distribution during semiconductor wafer polishing operations. The slurry is gravity fed or fed under pressure and broadcast under an angle across the entire face of the polishing pad by either a rotating slurry nozzle arrangement or by a rotating slurry shaft arrangement. This as opposed to the conventional slurry supply lines, which are stationary in design.

Abstract: A carrier head is provided that improves the pressure uniformity of a semiconductor wafer against the polishing pad in chemical mechanical polishing (CMP). The carrier head includes a carrier, a carrier film, and a guide ring. The objective of CMP is to provide planarization of the surface of a semiconductor wafer by uniformly removing material. One embodiment of the invention uses independent adjusting screws threaded in the carrier to provide uniform wafer pressure and lengthen guide ring life. The adjusting screws are threaded internally to accept holding screws attached to the guide ring using a backing. This facilitates variation in the spacing between the carrier and guide ring at each adjusting screw. A locking nut on each adjusting screw is used to maintain each gap setting. This embodiment eliminates the need for shims and the associated trial-and-error set-up time in selecting shims. In addition, compensating for guide ring wear can be easily performed without disassembling the carrier head.

Abstract: A carrier head is provided that improves the pressure uniformity of a semiconductor wafer against the polishing pad in chemical mechanical polishing (CMP). The carrier head includes a carrier, a carrier film, and a guide ring. The objective of CMP is to provide planarization of the surface of a semiconductor wafer by uniformly removing material. One embodiment of the invention uses independent adjusting screws threaded in the carrier to provide uniform wafer pressure and lengthen guide ring life. The adjusting screws are threaded internally to accept holding screws attached to the guide ring using a backing. This facilitates variation in the spacing between the carrier and guide ring at each adjusting screw. A locking nut on each adjusting screw is used to maintain each gap setting. This embodiment eliminates the need for shims and the associated trial-and-error set-up time in selecting shims. In addition, compensating for guide ring wear can be easily performed without disassembling the carrier head.

Abstract: A new method of chemical mechanical polishing using a submerged polishing table is described. A polishing table is provided having a polishing pad thereon wherein the polishing table is fixed within a container. A channel exists between an outer edge of the polishing table and an inner edge of the container. Outlets lie in a bottom surface of the channel. A wafer carrier presses a wafer onto the polishing pad. Slurry is dispensed onto the polishing pad at a high rate wherein the slurry polishes the wafer and wherein the slurry flushes away particles from a surface of the polishing pad into the container and out through the outlets. Even heavy particles such as diamond bits from a diamond-embedded dresser on the polishing pad can be flushed away using the method and polishing table of the invention.

Abstract: The purpose of the present invention is to provide a carrier mechanism, that polishes the wafer equally across the wafer surface by circumventing the problems caused by “pad rebound” or “waving phenomenon” during polishing. In doing this, pressure against the pad at the edge of the wafer will be equal to that at the center resulting in uniform pressure on the wafer during polishing and even planarization of thin film semiconductor material. One embodiment of the present invention uses a wider extension ring causing the pressure stress concentration point to occur just inside the outer edge of the extension ring and away from the wafer. This allows for constant pressure application to the surface of the wafer and results in uniform material removal across the wafer surface. A second embodiment of the present invention uses a wider extension ring having a slurry channel and a plurality of passageways.