Abstract: An arrangement of a heat sink and a heat-generating electronic component is provided. The heat sink has a main part and a moulding of plastic. The electronic component is mounted on a first surface of the main part with thermal contact to the main part. The moulding is mounted to a second surface of the main part, opposite the first surface, to provide structural strength to the arrangement. The moulding has a void provided through the moulding. As a result, once the moulding and the main part are mounted to each other, a portion of the second surface of the main part is exposed through the void.

Abstract: The invention concerns an arrangement of a heat sink and heat-generating electronic components housed thereon, in which the heat sink comprises a main part (1) and a moulding (2) of plastic with first fitting interfaces, in which the electronic components are arranged on the first side (7) of the main part (1) with thermal contact to said main part, and in which sections of a second side (8) of the main part (1) opposite the first side (7) are not insert moulded.