Patents by Inventor Sebastian T. M. Soon

Sebastian T. M. Soon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multichip module package and fabrication method
    Patent number: 7928564
    Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: April 19, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Il Kwon Shim, Dario S. Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon
  • MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
    Publication number: 20090014866
    Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
    Type: Application
    Filed: September 24, 2008
    Publication date: January 15, 2009
    Inventors: Il Kwon Shim, Dario S. Filoteo, JR., Tsz Yin Ho, Sebastian T. M. Soon
  • Multichip module package and fabrication method
    Patent number: 7445955
    Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
    Type: Grant
    Filed: July 12, 2005
    Date of Patent: November 4, 2008
    Assignee: Stats Chippac Ltd.
    Inventors: Il Kwon Shim, Dario S Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon
  • Multichip module package and fabrication method
    Patent number: 6943057
    Abstract: A method for fabricating a multichip module package includes providing a first heat sink positioned for releasing heat from the package and providing a second heat sink positioned proximate the first heat sink. The heat sinks are thermally coupled and electrically isolated to and from one another. A first semiconductor device is attached to the first heat sink in thermal and electrical communication therewith and electrically insulated from the second heat sink. A second semiconductor device is attached to the second heat sink in thermal and electrical communication therewith and electrically insulated from the first heat sink.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: September 13, 2005
    Assignee: Stats Chippac Ltd.
    Inventors: IL Kwon Shim, Dario S. Filoteo, Jr., Tsz Yin Ho, Sebastian T. M. Soon